Global Semiconductor Bare Die Market 2018-2022

半導体ベアダイの世界市場2018-2022

◆タイトル:Global Semiconductor Bare Die Market 2018-2022
◆商品コード:IRTNTR21390
◆調査・発行会社:Technavio (Infiniti Research Ltd.)
◆発行日:2018年4月19日
◆ページ数:132
◆資料形式:PDF / 英語
◆納品方法:Eメール(受注後24時間以内)
◆調査対象地域:グローバル
◆産業分野:Hardware and Semiconductor
◆販売価格オプション(消費税別)
Single User(1名様閲覧用)USD3,500 ⇒換算¥385,000見積依頼/購入/質問フォーム
Five User(5名様閲覧用)USD4,000 ⇒換算¥440,000見積依頼/購入/質問フォーム
Enterprise License(同一法人内共有可)USD5,000 ⇒換算¥550,000見積依頼/購入/質問フォーム
販売価格オプションの説明はこちらでご利用ガイドはこちらでご確認いただけます。
※お支払金額は「換算金額(日本円)+消費税+配送料(Eメール納品は無料)」です。
※Eメールによる納品の場合、通常ご注文当日~2日以内に納品致します。
※商品の納品後、納品日+5日以内に請求書を発行し、お客様宛に郵送いたしますので、請求書発行日より2ヶ月以内に銀行振込にて支払をお願いします。(振込先:三菱東京UFJ銀行/京橋支店/H&Iグローバルリサーチ株式会社)
※上記の日本語題名はH&Iグローバルリサーチが翻訳したものです。英語版原本には日本語表記はありません。
※為替レートは適宜修正・更新しております。リアルタイム更新ではありません。
※ご購入後、資料に記載の英語表現や単語の意味に関しましては無料でお答えいたします。(但し、対応範囲は弊社で判断)
※弊社H&Iグローバルリサーチ株式会社はTechnavio (Infiniti Research Ltd.)の日本における正規販売代理店です。

【資料の概要】

当調査レポートでは、半導体ベアダイの世界市場について調査・分析し、市場概要、市場環境、半導体ベアダイ市場規模、用途別(家電、コンピューター、工業、通信、その他)分析、市場動向、競争環境、主要地域別市場規模(アメリカ、ヨーロッパ、アジアなど)、関連企業情報などを含め、以下の構成でお届け致します。
・エグゼクティブサマリー
・調査範囲・調査手法
・半導体ベアダイの世界市場概要
・半導体ベアダイの世界市場環境
・半導体ベアダイの世界市場動向
・半導体ベアダイの世界市場規模
・半導体ベアダイの世界市場:業界構造分析
・半導体ベアダイの世界市場:用途別(家電、コンピューター、工業、通信、その他)
・半導体ベアダイの世界市場:地域別市場規模・分析
・半導体ベアダイのアメリカ市場規模・予測
・半導体ベアダイのヨーロッパ市場規模・予測
・半導体ベアダイのアジア市場規模・予測
・半導体ベアダイの主要国分析
・半導体ベアダイの世界市場:意思決定フレームワーク
・半導体ベアダイの世界市場:成長要因、課題
・半導体ベアダイの世界市場:競争環境
・半導体ベアダイの世界市場:関連企業情報(ベンダー分析)

About Semiconductor Bare Die

Semiconductor manufacturers produce wafers, from which a die is yielded. During the semiconductor wafer fabrication process, after the wafer testing phase, the wafer is diced into individual dies. These individual dies are given a part number and are delivered to bare die distributors. These semiconductor dies, which are not packaged, are referred to as semiconductor bare dies.

Technavio’s analysts forecast the global semiconductor bare die market will register a revenue of close to USD 23 billion by 2022.

Covered in this report
The report covers the present scenario and the growth prospects of the global semiconductor bare die market for 2018-2022. To calculate the market size, the report presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources.

The market is divided into the following segments based on geography:
• Americas
• APAC
• EMEA

Technavio’s report, Global Semiconductor Bare Die Market 2018-2022, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
• Analog Devices
• Infineon Technologies
• ON Semiconductor
• ROHM Semiconductor
• Texas Instruments

Market driver
• Emergence of advanced and compact consumer electronic devices
• For a full, detailed list, view our report

Market challenge
• High inventory levels in the supply chain
• For a full, detailed list, view our report

Market trend
• Continuous decrease in lithography wavelength
• For a full, detailed list, view our report

Key questions answered in this report
• What will the market size be in 2022 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?

You can request one free hour of our analyst’s time when you purchase this market report. Details are provided within the report.

【資料の目次】

PART 01: EXECUTIVE SUMMARY
PART 02: SCOPE OF THE REPORT
PART 03: RESEARCH METHODOLOGY
PART 04: MARKET LANDSCAPE
• Market ecosystem
• Market characteristics
• Market segmentation analysis
PART 05: MARKET SIZING
• Market definition
• Market sizing 2017
• Market size and forecast 2017-2022
PART 06: FIVE FORCES ANALYSIS
• Bargaining power of buyers
• Bargaining power of suppliers
• Threat of new entrants
• Threat of substitutes
• Threat of rivalry
• Market condition
PART 07: MARKET SEGMENTATION BY APPLICATION
• Segmentation by application
• Comparison by application
• Consumer electronics – Market size and forecast 2017-2022
• Computers – Market size and forecast 2017-2022
• Industrial – Market size and forecast 2017-2022
• Telecommunications – Market size and forecast 2017-2022
• Others – Market size and forecast 2017-2022
• Market opportunity by application
PART 08: CUSTOMER LANDSCAPE
PART 09: REGIONAL LANDSCAPE
• Geographical segmentation
• Regional comparison
• APAC – Market size and forecast 2017-2022
• Americas – Market size and forecast 2017-2022
• EMEA – Market size and forecast 2017-2022
• Market opportunity
PART 10: DECISION FRAMEWORK
PART 11: DRIVERS AND CHALLENGES
• Market drivers
• Market challenges
PART 12: MARKET TRENDS
• Continuous decrease in the lithography wavelength
• Growing proliferation of the IoT and connected devices
• Growing acceptance of wearable devices
• Increase in the wafer size
• Growth of smart cities
• Automation in automobiles
PART 13: VENDOR LANDSCAPE
• Overview
• Landscape disruption
• Competitive scenario
PART 14: VENDOR ANALYSIS
• Vendors covered
• Vendor classification
• Market positioning of vendors
• Analog Devices
• Infineon Technologies
• ON Semiconductor
• ROHM Semiconductor
• Texas Instruments
PART 15: APPENDIX
• List of abbreviations
Exhibit 01: Parent market
Exhibit 02: Semiconductor value chain
Exhibit 03: Front-end processes
Exhibit 04: Back-end processes
Exhibit 05: Global semiconductor market
Exhibit 06: Market characteristics
Exhibit 07: Market segments
Exhibit 08: Market definition – Inclusions and exclusions checklist
Exhibit 09: Market size 2017
Exhibit 10: Validation techniques employed for market sizing 2017
Exhibit 11: Global semiconductor bare die market – Market size and forecast 2017-2022 ($ bn)
Exhibit 12: Global semiconductor bare die market – Year-over-year growth 2018-2022 (%)
Exhibit 13: Global semiconductor bare die market 2017-2022
Exhibit 14: Five forces analysis 2017
Exhibit 15: Five forces analysis 2022
Exhibit 16: Bargaining power of buyers
Exhibit 17: Bargaining power of suppliers
Exhibit 18: Threat of new entrants
Exhibit 19: Threat of substitutes
Exhibit 20: Threat of rivalry
Exhibit 21: Market condition – Five forces 2017
Exhibit 22: Global semiconductor bare die market by application – Market share 2017-2022 (%)
Exhibit 23: Comparison by application
Exhibit 24: Consumer electronics – Market size and forecast 2017-2022 ($ bn)
Exhibit 25: Consumer electronics – Year-over-year growth 2018-2022 (%)
Exhibit 26: Computers – Market size and forecast 2017-2022 ($ bn)
Exhibit 27: Computers – Year-over-year growth 2018-2022 (%)
Exhibit 28: Industrial – Market size and forecast 2017-2022 ($ bn)
Exhibit 29: Industrial – Year-over-year growth 2018-2022 (%)
Exhibit 30: Telecommunications – Market size and forecast 2017-2022 ($ bn)
Exhibit 31: Telecommunications – Year-over-year growth 2018-2022 (%)
Exhibit 32: Others – Market size and forecast 2017-2022 ($ bn)
Exhibit 33: Others – Year-over-year growth 2018-2022 (%)
Exhibit 34: Market opportunity by application
Exhibit 35: Customer landscape
Exhibit 36: Global semiconductor bare die market by geography – Market share 2017-2022 (%)
Exhibit 37: Regional comparison
Exhibit 38: APAC – Market size and forecast 2017-2022 ($ bn)
Exhibit 39: APAC – Year-over-year growth 2018-2022 (%)
Exhibit 40: Top 3 countries in APAC
Exhibit 41: Americas – Market size and forecast 2017-2022 ($ bn)
Exhibit 42: Americas – Year-over-year growth 2018-2022 (%)
Exhibit 43: Top 3 countries in the Americas
Exhibit 44: EMEA – Market size and forecast 2017-2022 ($ bn)
Exhibit 45: EMEA – Year-over-year growth 2018-2022 (%)
Exhibit 46: Top 3 countries in EMEA
Exhibit 47: Market opportunity
Exhibit 48: Global semiconductor market growth trend 2000-2017
Exhibit 49: Node transition in the semiconductor industry
Exhibit 50: Requirements for the IoT
Exhibit 51: Timeline for semiconductor wafer size advances
Exhibit 52: Partner cities selected under the EU-China PDSF initiative
Exhibit 53: Vendor landscape
Exhibit 54: Landscape disruption
Exhibit 55: Vendors covered
Exhibit 56: Vendor classification
Exhibit 57: Market positioning of vendors
Exhibit 58: Analog Devices – Overview
Exhibit 59: Analog Devices – Product segments
Exhibit 60: Analog Devices – Organizational developments
Exhibit 61: Analog Devices – Geographic focus
Exhibit 62: Analog Devices – Segment focus
Exhibit 63: Analog Devices – Key offerings
Exhibit 64: Infineon Technologies overview
Exhibit 65: Infineon Technologies – Business segments
Exhibit 66: Infineon Technologies – Organizational developments
Exhibit 67: Infineon Technologies – Geographic focus
Exhibit 68: Infineon Technologies – Segment focus
Exhibit 69: Infineon Technologies – Key offerings
Exhibit 70: ON Semiconductor – Overview
Exhibit 71: ON Semiconductor – Business segments
Exhibit 72: ON Semiconductor – Organizational developments
Exhibit 73: ON Semiconductor – Geographic focus
Exhibit 74: ON Semiconductor – Segment focus
Exhibit 75: ON Semiconductor – Key offering
Exhibit 77: ROHM Semiconductor overview
Exhibit 78: ROHM Semiconductor – Business segments
Exhibit 79: ROHM Semiconductor – Organizational developments
Exhibit 80: ROHM Semiconductor – Geographic focus
Exhibit 81: ROHM Semiconductor – Segment focus
Exhibit 82: ROHM Semiconductor – Key offerings
Exhibit 83: Texas Instruments overview
Exhibit 84: Texas Instruments – Business segments
Exhibit 85: Texas Instruments – Organizational developments
Exhibit 86: Texas Instruments – Geographic focus
Exhibit 87: Texas Instruments – Segment focus
Exhibit 88: Texas Instruments – Key offerings



【掲載企業】

Analog Devices, Infineon Technologies, ON Semiconductor, ROHM Semiconductor, and Texas Instruments.

★調査レポート[半導体ベアダイの世界市場2018-2022] (Global Semiconductor Bare Die Market 2018-2022 / IRTNTR21390)販売に関する免責事項
[半導体ベアダイの世界市場2018-2022] (Global Semiconductor Bare Die Market 2018-2022 / IRTNTR21390)についてEメールでお問い合わせ


◆H&Iグローバルリサーチ株式会社のお客様(例)◆