Global Semiconductor Packaging Materials Market 2017-2021

半導体パッケージング材料の世界市場2017-2021

◆タイトル:Global Semiconductor Packaging Materials Market 2017-2021
◆商品コード:IRTNTR15950
◆調査・発行会社:Technavio (Infiniti Research Ltd.)
◆発行日:2017年11月14日
◆ページ数:136
◆資料形式:PDF / 英語
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◆調査対象地域:グローバル
◆産業分野:半導体
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【資料の概要】

Technavio社が発行した当調査レポートでは、半導体パッケージング材料の世界市場について調査・分析し、エグゼクティブサマリー、市場概観、市場概観、業界の構造分析、半導体パッケージング材料の世界市場規模及び予測、材料別分析、地域別分析/市場規模、市場の成長要因、市場の課題、市場動向、競争状況などの情報をお届けいたします。Technavio社は半導体パッケージング材料の世界市場が2017-2021年期間中に年平均5.27%成長すると予測しています。当レポート上に記載されている主な企業は、Amkor Technology、DuPont、Henkel、Honeywell、Kyocera、Toppan Printing等です。

About Semiconductor Packaging MaterialsSemiconductor packages are plastic, ceramic, and metal components that are not only protect fabricated integrated circuits (ICs) on the semiconductor die, but also act as an interconnect between the printed circuit board (PCB) and the die during shipping and handling. These packaging materials safeguard and protect the die from the external mechanical impacts and corrosion, besides acting as an electrically conductive interconnection with excellent signal propagation properties. Excessive heat in the integrated circuit is dissipation through attached heat spreaders. Semiconductor packaging components vary in dimensions and functionality and are mainly organic substrates, bonding wires, encapsulation resins, lead frames, thermal interface materials, die attach materials, and solder balls. The key customers of these packaging materials are the electronics industry, automotive sector, fabless semiconductor companies, packaging material suppliers, and packaging subcontractors.

Technavio’s analysts forecast the global semiconductor packaging materials market to grow at a CAGR of 5.27% during the period 2017-2021.

[Covered in this report]
The report covers the present scenario and the growth prospects of the global semiconductor packaging materials market for 2017-2021. To calculate the market size, the report considers the revenue generated by vendors through the sales of semiconductor packaging materials which are organic substrates, lead frames, bonding wires, encapsulation resins, die attach materials, solder balls, thermal interface materials, and WLP dielectrics.

The market is divided into the following segments based on geography:
• Americas
• APAC
• EMEA

Technavio’s report, Global Semiconductor Packaging Materials Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

[Key vendors]
• Amkor Technology
• DuPont
• Henkel
• Honeywell
• Kyocera
• Toppan Printing

[Other prominent vendors]
• Hitachi Chemical
• ASM Pacific Technology
• BASF
• Beijing Kehua New Chemical Technology

[Market driver]
• Increasing miniaturization of electronic devices and growing application of semiconductor ICs in IoT
• For a full, detailed list, view our report

[Market challenge]
• Capital-intensive market
• For a full, detailed list, view our report

[Market trend]
• Increase in adoption of flip-chip, Sip, lead-free packaging solutions
• For a full, detailed list, view our report

[Key questions answered in this report]
• What will the market size be in 2021 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?

*** You can request one free hour of our analyst’s time when you purchase this market report. Details are provided within the report.

【資料の目次】

Table of Contents
PART 01: EXECUTIVE SUMMARY

PART 02: SCOPE OF THE REPORT

PART 03: RESEARCH METHODOLOGY

PART 04: INTRODUCTION
• Market outline

PART 05: MARKET LANDSCAPE
• Market ecosystem
• Market characteristics
• Market segmentation analysis

PART 06: MARKET SIZING
• Market definition
• Market sizing 2016
• Market size and forecast 2016-2021

PART 07: FIVE FORCES ANALYSIS
• Bargaining power of buyers
• Bargaining power of suppliers
• Threat of new entrants
• Threat of substitutes
• Threat of rivalry
• Market condition

PART 08: CUSTOMER LANDSCAPE

PART 09: MARKET SEGMENTATION BY MATERIAL TYPE
• Segmentation by material type
• Organic substrates – Market size and forecast 2016-2021
• Lead frames – Market size and forecast 2016-2021
• Bonding wires – Market size and forecast 2016-2021
• Others – Market size and forecast 2016-2021
• Market opportunity by type of materials

PART 10: REGIONAL LANDSCAPE
• Geographical segmentation
• APAC – Market size and forecast 2016-2021
• Americas – Market size and forecast 2016-2021
• EMEA – Market size and forecast 2016-2021
• Market opportunity

PART 11: DECISION FRAMEWORK

PART 12: DRIVERS AND CHALLENGES
• Market drivers
• Market challenges

PART 13: MARKET TRENDS
• Increase in adoption of flip-chip, Sip, lead-free packaging solutions
• Growing preference of SMT (surface mount technology) over older through-hole technology and surge in popularity of redistributed chip packaging
• Surge in adoption of semiconductor ICs for automobiles and shift toward copper as bonding wire material

PART 14: VENDOR LANDSCAPE
• Competitive scenario

PART 15: VENDOR ANALYSIS
• Vendors covered
• Vendor classification
• Market positioning of vendors
• Amkor Technology
• DuPont
• Henkel
• Honeywell
• Kyocera
• Toppan Printing

PART 16: APPENDIX
• List of abbreviations

[List of Exhibits]
Exhibit 01: Steps in back-end chip formation
Exhibit 02: Roadmap of semiconductor packaging
Exhibit 03: Old supply chain of semiconductor IC packaging industry
Exhibit 04: New supply chain of semiconductor IC packaging industry
Exhibit 05: Related market
Exhibit 06: Semiconductor packaging materials technologies
Exhibit 07: Global semiconductor packaging materials market overview
Exhibit 08: Market characteristics
Exhibit 09: Market segments
Exhibit 10: Market definition – Inclusions and exclusions checklist
Exhibit 11: Market size 2016
Exhibit 12: Validation techniques employed for market sizing 2016
Exhibit 13: Global semiconductor packaging materials – Market size and forecast 2016-2021 ($ billions)
Exhibit 14: Global semiconductor packaging materials market– Year-over-year growth 2017-2021 (%)
Exhibit 15: Five forces analysis 2016
Exhibit 16: Five forces analysis 2021
Exhibit 17: Bargaining power of buyers
Exhibit 18: Bargaining power of suppliers
Exhibit 19: Threat of new entrants
Exhibit 20: Threat of substitutes
Exhibit 21: Threat of rivalry
Exhibit 22: Market condition in 2016 – Five forces
Exhibit 23: Customer landscape
Exhibit 24: Global semiconductor packaging materials by market type 2016-2021 (%)
Exhibit 25: Comparison by end-user
Exhibit 26: Organic substrates – Market size and forecast 2016-2021 ($ billions)
Exhibit 27: Organic substrates – Year-over-year growth 2017-2021 (%)
Exhibit 28: Lead frames – Market size and forecast 2016-2021 ($ billions)
Exhibit 29: Lead frames – Year-over-year growth 2017-2021 (%)
Exhibit 30: Bonding wires – Market size and forecast 2016-2021 ($ billions)
Exhibit 31: Bonding wires – Year over year growth 2017-2021 (%)
Exhibit 32: Others – Market size and forecast 2016-2021 ($ billions)
Exhibit 33: Others – Year-over-year growth 2017-2021 (%)
Exhibit 34: Market opportunity by material type
Exhibit 35: Global semiconductor packaging materials market share by geography 2016-2021 (%)
Exhibit 36: Regional comparison
Exhibit 37: APAC – Market size and forecast 2016-2021 ($ billions)
Exhibit 38: APAC – Year-over-year growth 2017-2021 (%)
Exhibit 39: Top 3 countries in Americas
Exhibit 40: Americas – Market size and forecast 2016-2021 ($ billions)
Exhibit 41: Americas – Year-over-year growth 2017-2021 (%)
Exhibit 42: Top 3 countries in EMEA
Exhibit 43: EMEA – Market size and forecast 2016-2021 ($ billions)
Exhibit 44: EMEA – Year-over-year growth 2017-2021 (%)
Exhibit 45: Top 3 countries in APAC
Exhibit 46: Vendor classification
Exhibit 47: Market positioning of vendors
Exhibit 48: Amkor Technology overview
Exhibit 49: Amkor Technology – Business segments
Exhibit 50: Amkor Technology– Organizational developments
Exhibit 51: Amkor Technology– Geographic focus
Exhibit 52: Amkor Technology – Business segment focus
Exhibit 53: Amkor Technology – Key application packaging products
Exhibit 54: DuPont overview
Exhibit 55: DuPont – Business segments
Exhibit 56: Dupont – Organizational developments
Exhibit 57: Dupont – Geographic focus
Exhibit 58: Dupont – Segment focus
Exhibit 59: Dupont – Key offerings
Exhibit 60: Henkel overview
Exhibit 61: Henkel – Business segments
Exhibit 62: Henkel – Organizational developments
Exhibit 63: Henkel – Geographic focus
Exhibit 64: Henkel – Segment focus
Exhibit 65: Henkel – Key offerings
Exhibit 66: Honeywell overview
Exhibit 67: Honeywell – Business segments
Exhibit 68: Honeywell – Organizational developments
Exhibit 69: Honeywell – Geographic focus
Exhibit 70: Honeywell – Segment focus
Exhibit 71: Honeywell – Key offerings
Exhibit 72: Kyocera overview
Exhibit 73: Kyocera – Business segments
Exhibit 74: Kyocera – Organizational developments
Exhibit 75: Kyocera – Geographic focus
Exhibit 76: Kyocera – Segment focus
Exhibit 77: Kyocera – Key offerings
Exhibit 78: Toppan Printing overview
Exhibit 79: Toppan Printing – Business segments
Exhibit 80: Toppan Printing – Organizational developments
Exhibit 81: Toppan Printing – Geographic focus
Exhibit 82: Toppan Printing – Segment focus
Exhibit 83: Toppan Printing – Key offerings



【掲載企業】

Amkor Technology, DuPont, Henkel, Honeywell, Kyocera, Toppan Printing, Hitachi Chemical, ASM Pacific Technology, BASF, and Beijing Kehua New Chemical Technology.


【資料のキーワード】

半導体パッケージング材料

★調査レポート[半導体パッケージング材料の世界市場2017-2021] (Global Semiconductor Packaging Materials Market 2017-2021 / IRTNTR15950)販売に関する免責事項
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