Global Semiconductor Assembly and Testing Services Market 2017-2021

半導体実装・試験サービスの世界市場2017-2021:実装サービス・試験サービス

◆タイトル:Global Semiconductor Assembly and Testing Services Market 2017-2021
◆商品コード:IRTNTR14585
◆調査・発行会社:Technavio (Infiniti Research Ltd.)
◆発行日:2017年10月16日
◆ページ数:75
◆資料形式:PDF / 英語
◆納品方法:Eメール(受注後24時間以内)
◆調査対象地域:グローバル
◆産業分野:産業装置・機械
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【資料の概要】

Technavio社が発行した当調査レポートでは、半導体実装・試験サービスの世界市場について調査・分析し、エグゼクティブサマリー、市場概観、市場概観、業界の構造分析、半導体実装・試験サービスの世界市場規模及び予測、サービス別分析、地域別分析/市場規模、市場の成長要因、市場の課題、市場動向、競争状況、主要企業(ベンダー)分析などの情報をお届けいたします。Technavio社は半導体実装・試験サービスの世界市場が2017-2021年期間中に年平均5.68%成長すると予測しています。当レポート上に記載されている主な企業は、Amkor Technology、ASE Group、Jiangsu Changjiang Electronics Technology (JCET)、Powertech Technology、Siliconware Precision Industries (SPIL)等です。

About Semiconductor Assembly and Testing Services
The number of electronic devices we use in our day-to-day life has been increasing in the past few decades. These devices range from simple media players, smartphones, laptops, and TVs to wearable smart watches and Internet of Things (IoT) devices such as connected thermostats, automated lighting, and remote health monitoring equipment. Semiconductor assembly and testing services (SATS) or outsourced semiconductor assembly and testing (OSAT) refers to the outsourcing of integrated circuit packaging and final product testing to third-party service providers.

Technavio’s analysts forecast the global semiconductor assembly and testing services market to grow at a CAGR of 5.68% during the period 2017-2021.

[Covered in this report]
The report covers the present scenario and the growth prospects of the global semiconductor assembly and testing services market for 2017-2021. The report presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources.

The market is divided into the following segments based on geography:
• Americas
• APAC
• EMEA

Technavio’s report, Global Semiconductor Assembly and Testing Services Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

[Key vendors]
• Amkor Technology
• ASE Group
• Jiangsu Changjiang Electronics Technology (JCET)
• Powertech Technology
• Siliconware Precision Industries (SPIL)

[Other prominent vendors]
• Chipbond Technology
• ChipMOS TECHNOLOGIES
• FormFactor
• Formosa Advanced Technologies
• King Yuan ELECTRONICS
• Lingsen Precision Industries
• PSi Technologies
• SIGNETICS
• Tessolve Semiconductor
• Tianshui Huatian Technology
• Unisem
• UTAC

[Market driver]
• Growth of cloud-based servers and big data services
• For a full, detailed list, view our report

[Market challenge]
• Highly cyclic nature of electronics industry
• For a full, detailed list, view our report

[Market trend]
• Growth of advanced system in package (SiP) modules
• For a full, detailed list, view our report

[Key questions answered in this report]
• What will the market size be in 2021 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?

*** You can request one free hour of our analyst’s time when you purchase this market report. Details are provided within the report.

【資料の目次】

Table of Contents
PART 01: Executive summary

PART 02: Scope of the report

PART 03: Research Methodology

PART 04: Introduction
• Market outline

PART 05: Market landscape
• Market overview
• Market size and forecast
• Five forces analysis

PART 06: Market segmentation by service
• Market overview
• Assembly services
• Testing services

PART 07: Geographical segmentation
• Market overview
• Semiconductor assembly and testing services market in APAC
• Semiconductor assembly and testing services market in Americas
• Semiconductor assembly and testing services market in EMEA

PART 08: Decision framework

PART 09: Drivers and challenges
• Market drivers
• Market challenges

PART 10: Market trends
• Growth of advanced system in package (SiP) modules
• Increasing focus of semiconductor suppliers on core competencies
• Growing demand for FOWLP solutions

PART 11: Vendor landscape
• Competitive scenario
• Other prominent vendors

PART 12: Key vendor analysis
• Amkor Technology
• ASE Group
• Jiangsu Changjiang Electronics Technology (JCET)
• Powertech Technology
• Siliconware Precision Industries (SPIL)

PART 13: Appendix
• List of abbreviations

[List of Exhibits]
Exhibit 01: Major semiconductor chip end-users
Exhibit 02: Integrated chipset manufacturing process
Exhibit 03: Global semiconductor assembly and testing services market overview
Exhibit 04: Global semiconductor assembly and testing services market 2017-2021 ($ billions)
Exhibit 05: Five forces analysis
Exhibit 06: Global semiconductor assembly and testing services market by service type 2016-2021 (%)
Exhibit 07: Global semiconductor assembly and testing services market by service type 2016-2021 ($ billions)
Exhibit 08: Global semiconductor assembly and testing services market by assembly service 2016-2021 ($ billions)
Exhibit 09: Annual decline in global smartphone ASP (2012-2019)
Exhibit 10: Global semiconductor assembly and testing services market by testing services 2016-2021 ($ billions)
Exhibit 11: Global semiconductor assembly and testing services market by geography 2016 and 2021 (%)
Exhibit 12: Global semiconductor assembly and testing services market by geography 2016-2021 ($ billions)
Exhibit 13: Semiconductor assembly and testing services market in APAC 2017-2021 ($ billions)
Exhibit 14: Per capita GDP growth of selected Asian countries 2010-2015 ($)
Exhibit 15: Semiconductor assembly and testing services market in Americas ($ billions)
Exhibit 16: Semiconductor assembly and testing services market in EMEA ($ billions)
Exhibit 17: Global vehicle sales growth 2011-2016
Exhibit 18: Key vendors 2016
Exhibit 19: Other prominent vendors
Exhibit 20: Amkor Technology: Product portfolio
Exhibit 21: Amkor Technology: Key news
Exhibit 22: ASE Group: Product portfolio
Exhibit 23: ASE Group: Key news
Exhibit 24: Jiangsu Changjiang Electronics Technology: Product portfolio
Exhibit 25: Jiangsu Changjiang Electronics Technology: Key news
Exhibit 26: Powertech technology: Product portfolio
Exhibit 27: Powertech Technology: Key news
Exhibit 28: Silicon Precision Industries: Product portfolio
Exhibit 29: Siliconware Precision Industries: Key news



【掲載企業】

Amkor Technology, ASE Group, Jiangsu Changjiang Electronics Technology (JCET), Powertech Technology, Siliconware Precision Industries (SPIL), Chipbond Technology, ChipMOS TECHNOLOGIES, FormFactor, Formosa Advanced Technologies, King Yuan ELECTRONICS, Lingsen Precision Industries, PSi Technologies, SIGNETICS, Tessolve Semiconductor, Tianshui Huatian Technology, Unisem, and UTAC.


★調査レポート[半導体実装・試験サービスの世界市場2017-2021:実装サービス・試験サービス] (Global Semiconductor Assembly and Testing Services Market 2017-2021 / IRTNTR14585)販売に関する免責事項
[半導体実装・試験サービスの世界市場2017-2021:実装サービス・試験サービス] (Global Semiconductor Assembly and Testing Services Market 2017-2021 / IRTNTR14585)についてEメールでお問い合わせ


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