Global Semiconductor Capital Equipment Market 2017-2021

半導体製造装置の世界市場2017-2021

◆タイトル:Global Semiconductor Capital Equipment Market 2017-2021
◆商品コード:IRTNTR14755
◆調査・発行会社:Technavio (Infiniti Research Ltd.)
◆発行日:2017年7月12日
◆ページ数:81
◆資料形式:PDF / 英語
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◆調査対象地域:グローバル
◆産業分野:装置・電子
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【資料の概要】

当調査レポートでは、半導体製造装置の世界市場について調査・分析し、エグゼクティブサマリー、市場概観、市場概観、業界の構造分析、半導体製造装置の世界市場規模及び予測、需要先別分析、地域別分析/市場規模、主要国別分析、市場の成長要因、市場の課題、市場動向、競争状況などの情報をお届けいたします。

半導体製造装置とは、半導体素子を製造する装置です。半導体素子を製造する装置は、そのプロセスによりフロントエンド装置とバックエンド装置に分類されます。フロントエンド装置には、ウエハー製造、リソグラフィ、成膜、エッチング、洗浄、化学機械研磨などが含まれます。バックエンド装置には、組み立て、パッケージング装置、IC検査が含まれます。Technavio社は半導体製造装置の世界市場が2017-2021年期間中に年平均6.36 %成長すると予測しています。当レポート上に記載されている主な企業は• Applied Materials • ASML• KLA-Tencor• Lam Research• Tokyo Electron等です。

About Semiconductor Capital EquipmentSemiconductor capital equipment is machinery used in the production of semiconductor devices. Equipment for manufacturing semiconductor devices is classified as front-end or back-end based on the processes used. Front-end includes wafer fabrication along with other functions such as lithography, deposition, etching, cleaning, and chemical and mechanical polishing to name a few. Back-end encompasses assembly, packaging, and testing of ICs. Semiconductors are the building blocks for electronics. They form the crucial core of any electronic component. Semiconductor capital spending essentially refers to the capital investments by vendors in the semiconductor domain.

Technavio’s analysts forecast the global semiconductor capital equipment market to grow at a CAGR of 6.36 % during the period 2017-2021.

[Covered in this report]
The report covers the present scenario and the growth prospects of the global semiconductor capital equipment market for 2017-2021. To calculate the market size, the report considers the sale of semiconductor capital equipment to end-user segments.

The market is divided into the following segments based on geography:
• Americas
• APAC
• EMEA

Technavio’s report, Global Semiconductor Capital Equipment Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

[Key vendors]
• Applied Materials
• ASML
• KLA-Tencor
• Lam Research
• Tokyo Electron

[Other prominent vendors]
• ASM International
• ADVANTEST
• Hitachi High-Technologies
• Kulicke & Soffa
• Nikon
• Planar
• Rudolph Technologies
• SCREEN Semiconductor Solutions (SCREEN Holdings)
• Teradyne
• TOKYO SEIMITSU
• Veeco Instruments

[Market driver]
• Integration of semiconductor devices across industrial sectors
• For a full, detailed list, view our report

[Market challenge]
• High inventory levels in supply chain
• For a full, detailed list, view our report

[Market trend]
• Rapid changes in technology driving equipment orders
• For a full, detailed list, view our report

[Key questions answered in this report]
• What will the market size be in 2021 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?
• What are the market opportunities and threats faced by the key vendors?
• What are the strengths and weaknesses of the key vendors?

*** You can request one free hour of our analyst’s time when you purchase this market report. Details are provided within the report.

【資料の目次】

PART 01: Executive summary

PART 02: Scope of the report

PART 03: Research Methodology

PART 04: Introduction
• Market outline
• Semiconductor industry value chain

PART 05: Market landscape
• Market overview
• Market size and forecast
• Five forces analysis

PART 06: Market segmentation by equipment type
• Global semiconductor capital equipment by type
• Wafer-level manufacturing equipment
• Die-level packaging and assembly equipment
• Automated test equipment

PART 07: Market segmentation by end-user
• Global semiconductor capital equipment by end-user
• Foundries
• Memory manufacturers
• IDMs

PART 08: Geographical segmentation
• Global semiconductor capital equipment market by geography
• APAC
• Americas
• EMEA

PART 09: Key leading countries
• Key leading countries
• Taiwan
• South Korea
• Japan
• China

PART 10: Decision framework

PART 11: Drivers and challenges
• Market drivers
• Market challenges

PART 12: Market trends
• Rapid changes in technology driving equipment orders
• Rising prominence of 3D packaging
• Large-scale development of the Chinese semiconductor industry
• Automation in automobiles
• Development of multi-beam e-beam inspection
• Proliferation of IoT technology

PART 13: Vendor landscape
• Competitive scenario
• Key vendors
• Other prominent vendors

PART 14: Appendix
• List of abbreviations

[List of Exhibits]
Exhibit 01: Semiconductor industry value chain
Exhibit 02: Description of semiconductor industry value chain
Exhibit 03: Segmentation of global semiconductor capital equipment market
Exhibit 04: Global semiconductor capital equipment market 2016-2021 ($ billions)
Exhibit 05: Requirements for semiconductor capital equipment
Exhibit 06: Factors influencing the purchase decisions
Exhibit 07: Five forces analysis
Exhibit 08: Global semiconductor capital equipment market by type 2016-2021 (% share of revenue)
Exhibit 09: Global semiconductor capital equipment market by type 2016-2021 ($ billions)
Exhibit 10: Global semiconductor capital equipment by wafer-level manufacturing equipment market 2016-2021 ($ billions)
Exhibit 11: Global semiconductor capital equipment market by die-level packaging and assembly equipment 2016-2021 ($ billions)
Exhibit 12: Global semiconductor capital equipment market by automated test equipment 2016-2021 ($ billions)
Exhibit 13: Global semiconductor capital equipment market by end-user 2016-2021 (% share of revenue)
Exhibit 14: Global semiconductor capital equipment market by end-user 2016-2021 ($ billions)
Exhibit 15: Global semiconductor capital equipment market by foundries 2016-2021 ($ billions)
Exhibit 16: Global semiconductor capital equipment market by memory manufacturers 2016-2021 ($ billions)
Exhibit 17: Global semiconductor capital equipment market by IDMs 2016-2021 ($ billions)
Exhibit 18: Global semiconductor capital equipment market by geography 2016-2021 (% share of revenue)
Exhibit 19: Global semiconductor capital equipment market by geography 2016-2021 ($ billions)
Exhibit 20: Semiconductor capital equipment market in APAC 2016-2021 ($ billions)
Exhibit 21: Global semiconductor capital equipment market in Americas 2016-2021 ($ billions)
Exhibit 22: Semiconductor capital equipment market in EMEA 2016-2021 ($ billions)
Exhibit 23: Key leading countries
Exhibit 24: Share of key leading countries 2016-2021 (% share of revenue)
Exhibit 25: Forecast by application of semiconductor devices 2016 and 2021 (% share of revenue)
Exhibit 26: Global NAND flash market 2016-2021 (% share of revenue)
Exhibit 27: Global semiconductor market trend 1990-2016 ($ billions)
Exhibit 28: Timeline for semiconductor wafer size advances
Exhibit 29: Principle parameters of competition
Exhibit 30: R&D spending of leading vendors 2016
Exhibit 31: Vendor share in global semiconductor capital equipment market 2016 (% share of revenue)
Exhibit 32: Key vendors
Exhibit 33: Other prominent vendors



【掲載企業】

Applied Materials, ASML, KLA-Tencor, Lam Research, and Tokyo Electron.
ASM International, ADVANTEST, Hitachi High-Technologies, Kulicke & Soffa, Nikon, Planar, Rudolph Technologies, SCREEN Semiconductor Solutions (SCREEN Holdings), Teradyne, TOKYO SEIMITSU, and Veeco Instruments.


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