Global Semiconductor Advanced Packaging Market 2017-2021

半導体向け先進パッケージングの世界市場

◆タイトル:Global Semiconductor Advanced Packaging Market 2017-2021
◆商品コード:IRTNTR13879
◆調査・発行会社:Technavio (Infiniti Research Ltd.)
◆発行日:2017年8月2日
◆ページ数:84
◆資料形式:PDF / 英語
◆納品方法:Eメール(受注後24時間以内)
◆調査対象地域:グローバル
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【資料の概要】

当調査レポートでは、半導体向け先進パッケージングの世界市場について調査・分析し、エグゼクティブサマリー、市場概観、市場概観、業界の構造分析、半導体向け先進パッケージングの世界市場規模及び予測、技術別分析、デバイス別分析、地域別分析/市場規模、市場の成長要因、市場の課題、市場動向、競争状況などの情報をお届けいたします。Technavio社は半導体向け先進パッケージングの世界市場が2017-2021年期間中に年平均8.45%成長すると予測しています。当レポート上に記載されている主な企業は• Advanced Semiconductor Engineering (ASE)• Amkor Technology• Samsung Semiconductor (SAMSUNG)• TSMC (Taiwan Semiconductor Manufacturing Company)等です。

About Semiconductor Advanced Packaging Semiconductor packaging is carried out to provide protection to the wafer or substrate. The casing (package) is built from materials such as plastic, metal, glass, or ceramic and contains one or more semiconductor electronic components. Semiconductor advanced packaging is a key component of the semiconductor manufacturing process. The package of a semiconductor device is usually made of materials such as plastic, metal, ceramic/glass. Packaging is undertaken to provide protection against impact and corrosion. It also has contact pins or leads used to connect external circuits to the device; the package also dissipates the heat produced in the device. Some of the advanced packaging technologies used in semiconductor device packaging are fan-out wafer-level packaging (FO WLP), flip-chip, fan-in wafer-level packaging (FI WLP), and 2.5D/3D.

Technavio’s analysts forecast the global semiconductor advanced packaging market to grow at a CAGR of 8.45% during the period 2017-2021.

[Covered in this report]
The report covers the present scenario and the growth prospects of the global semiconductor advanced packaging market for 2017-2021. To calculate the market size, the report considers the sale of semiconductor capital equipment to end-use segments.

The market is divided into the following segments based on geography:
• Americas
• APAC
• EMEA

Technavio’s report, Global Semiconductor Advanced Packaging Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

[Key vendors]
• Advanced Semiconductor Engineering (ASE)
• Amkor Technology
• Samsung Semiconductor (SAMSUNG)
• TSMC (Taiwan Semiconductor Manufacturing Company)

[Other prominent vendors]
• China Wafer Level CSP
• ChipMOS TECHNOLOGIES
• FlipChip International
• HANA Micron
• Interconnect Systems (Molex)
• Jiangsu Changjiang Electronics Technology (JCET)
• King Yuan Electronics
• Tongfu Microelectronics
• Nepes
• Powertech Technology (PTI)
• SIGNETICS
• Tianshui Huatian
• Ultratech
• UTAC

[Market driver]
• Complex semiconductor IC designs
• For a full, detailed list, view our report

[Market challenge]
• Rapid technological changes
• For a full, detailed list, view our report

[Market trend]
• Changes in wafer size
• For a full, detailed list, view our report

[Key questions answered in this report]
• What will the market size be in 2021 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?

*** You can request one free hour of our analyst’s time when you purchase this market report. Details are provided within the report.

【資料の目次】

Table of Contents
PART 01: Executive summary

PART 02: Scope of the report

PART 03: Research Methodology

PART 04: Introduction
• Market outline
• Semiconductor value chain

PART 05: Technology landscape
• Back-end chip formation
• Wafer-level vs die-level packaging
• Roadmap of semiconductor packaging industry
• Ecosystem of semiconductor IC packaging industry

PART 06: Market landscape
• Market overview
• Market size and forecast
• Five forces analysis

PART 07: Segmentation by packaging technology
• Global semiconductor advanced packaging market by technology
• Flip-chip packaging
• FI WLP
• 2.5D/3D packaging
• FO WLP

PART 08: Segmentation by device type
• Global semiconductor advanced packaging market by device type
• Analog and mixed ICs
• MEMS and sensors
• Logic and memory devices
• Wireless connectivity devices
• CMOS image sensors

PART 09: Geographical segmentation
• Global semiconductor advanced packaging market by region
• APAC
• Americas
• EMEA

PART 10: Decision framework

PART 11: Drivers and challenges
• Market drivers
• Market challenges

PART 12: Market trends
• Changes in wafer size
• Integration of semiconductor components in vehicles
• Increase in number of M&A
• Short product lifecycle of mobile devices
• Increase in number of OSAT vendors
• High need for semiconductor memory devices
• Growing acceptance of wearable devices

PART 13: Vendor landscape
• Competitive scenario
• Leading vendors
• Other prominent vendors

PART 14: Appendix
• List of abbreviations

[List of Exhibits]
Exhibit 01: Semiconductor value chain
Exhibit 02: Description of semiconductor value chain
Exhibit 03: Back-end chip formation steps
Exhibit 04: Roadmap of semiconductor packaging industry
Exhibit 05: Block diagram for SoC
Exhibit 06: Block diagram of SiP
Exhibit 07:.5D IC block diagram
Exhibit 08:D IC block diagram
Exhibit 09: Old semiconductor IC packaging industry supply chain
Exhibit 10: New semiconductor IC packaging industry supply chain
Exhibit 11: Overview of global semiconductor advanced packaging market 2016
Exhibit 12: Global semiconductor advanced packaging market 2016-2021 ($ billions)
Exhibit 13: Five forces analysis
Exhibit 14: Global semiconductor advanced packaging market by technology 2016-2021
Exhibit 15: Revenue trend-line for technologies in advanced semiconductor packaging 2016-2021 ($ billions)
Exhibit 16: Global semiconductor advanced packaging market in flip-chip packaging 2016-2021 ($ billions)
Exhibit 17: Global semiconductor advanced packaging market FI WLP 2016-2021 ($ billions)
Exhibit 18: Global semiconductor advanced packaging market in 2.5D/3D packaging 2016-2021 ($ billions)
Exhibit 19: Global semiconductor advanced packaging market for fan-out WLP 2016-2021 ($ billions)
Exhibit 20: Global semiconductor advanced packaging market by device type 2016-2021
Exhibit 21: Revenue trend-line for global semiconductor advanced packaging market by device type 2016-2021 ($ billions)
Exhibit 22: Global semiconductor advanced packaging market for analog and mixed ICs 2016-2021 ($ billions)
Exhibit 23: Global semiconductor advanced packaging market for MEMS and sensors 2016-2021 ($ billions)
Exhibit 24: Global semiconductor advanced packaging market for logic and memory devices 2016-2021 ($ billions)
Exhibit 25: Global semiconductor advanced packaging market for wireless connectivity devices 2016-2021 ($ billions)
Exhibit 26: Global semiconductor advanced packaging market for CMOS image sensors 2016-2021 ($ billions)
Exhibit 27: Global semiconductor advanced packaging market by region 2016-2021
Exhibit 28: Revenue trend-line for global semiconductor advanced packaging market by region 2016-2021 ($ billions)
Exhibit 29: Semiconductor advanced packaging market in APAC 2016-2021 ($ billions)
Exhibit 30: Semiconductor advanced packaging market in the Americas 2016-2021 ($ billions)
Exhibit 31: Semiconductor advanced packaging market in EMEA 2016-2021 ($ billions)
Exhibit 32: Global IoT market by devices 2016-2021 ($ billions)
Exhibit 33: Global wrist computer market 2016-2021 ($ millions)
Exhibit 34: Product segmentation of global rugged handheld devices market 2016-2021 ($ millions)
Exhibit 35: Global semiconductor market trend 1992-2016 ($ billions)
Exhibit 36: Timeline: Advances in semiconductor wafer size
Exhibit 37: Global car shipment 2016-2021 (million units)
Exhibit 38: CAGR of 3D NAND and DRAM during 2016-2021
Exhibit 39: Global wearable devices market 2016-2021 ($ billions)
Exhibit 40: Other vendors in global semiconductor advanced packaging market 2016



【掲載企業】

Advanced Semiconductor Engineering (ASE), Amkor Technology, Samsung Semiconductor (SAMSUNG), and TSMC (Taiwan Semiconductor Manufacturing Company).

Other Prominent Vendors in the market are: China Wafer Level CSP, ChipMOS TECHNOLOGIES, FlipChip International, HANA Micron, Interconnect Systems (Molex), Jiangsu Changjiang Electronics Technology (JCET), King Yuan Electronics, Tongfu Microelectronics, Nepes, Powertech Technology (PTI), SIGNETICS, Tianshui Huatian, Ultratech, and UTAC.


【資料のキーワード】

半導体先進パッケージング

【調査方法】

一次資料による調査(業界専門家、ベンダー、代理店、顧客等を対象にしたデプスインタビュー調査など)及び二次資料による調査(Technavio独自のプラットフォーム、産業書籍、企業報告書、ニュース記事、アナリストレポート、貿易協会、政府機関発行データなど)

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