Global Fan-in Wafer Level Packaging Market 2016-2020

ファンインWLP(ウェハーレベルパッケージ)の世界市場2016-2020

◆タイトル:Global Fan-in Wafer Level Packaging Market 2016-2020
◆商品コード:IRTNTR10665
◆調査・発行会社:Technavio (Infiniti Research Ltd.)
◆発行日:2016年10月25日
◆ページ数:62
◆資料形式:PDF / 英語
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◆調査対象地域:グローバル
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【資料の概要】

当調査レポートでは、ファンインWLP(ウェハーレベルパッケージ)の世界市場について調査・分析し、エグゼクティブサマリー、市場概観、市場概観、業界の構造分析、ファンインWLP(ウェハーレベルパッケージ)の世界市場規模及び予測、用途別分析、地域別分析/市場規模、市場の成長要因、市場の課題、市場動向、競争状況などの情報をお届けいたします。

About Fan-in WLPChip-scale packaging (CSP) emerged in the 1990s. By 1998, wafer-level CSPs emerged as the most preferred form of chip packaging solutions due to their low cost benefits in applications, ranging from application-specific integrated circuits (ASICs) and microprocessors to electrically erasable programmable read-only memory (EEPROM). WLP is one of the key trending technologies used for CSP and is gaining popularity among fabless and foundry companies globally.
Technavio’s analysts forecast the global fan-in WLP market to grow at a CAGR of 9.63% during the period 2016-2020.

[Covered in this report]
The report covers the present scenario and the growth prospects of the global fan-in WLP market for 2016-2020. To calculate the market size, the report considers the revenue generated from the sales of packaged fan-in WLPs in various application segments such as analog and mixed IC, wireless connectivity, logic and memory IC, micro-electro-mechanical systems (MEMS) and sensors, and complementary metal-oxide-semiconductor (CMOS) image sensor

The market is divided into the following segments based on geography:
• APAC
• North America
• Europe

Technavio’s report, Global Fan-in WLP Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

[Key vendors]
• STATS ChipPAC
• STMicroelectronics
• TSMC
• Texas Instruments

[Other prominent vendors]
• Rudolph Technologies
• SEMES
• SUSS MicroTec
• Ultratech
• FlipChip International

[Market driver]
• High demand for miniaturized electronics
• For a full, detailed list, view our report

[Market challenge]
• Cyclical nature of semiconductor industry
• For a full, detailed list, view our report

[Market trend]
• Increase in wafer size
• For a full, detailed list, view our report

[Key questions answered in this report]
• What will the market size be in 2020 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?
• What are the market opportunities and threats faced by the key vendors?
• What are the strengths and weaknesses of the key vendors?

※You can request one free hour of our analyst’s time when you purchase this market report. Details are provided within the report.

【資料の目次】

PART 01: Executive summary
• Highlights

PART 02: Scope of the report
• Market coverage
• Base year and forecast period
• Vendor segmentation
• Market segmentation
• Geographical segmentation

PART 03: Market research methodology
• Research methodology
• Economic indicators
• PEST analysis

PART 04: Introduction
• Key market highlights

PART 05: Technology landscape
• Semiconductor IC manufacturing process
• WLP versus die-level packaging and assembly
• Roadmap of semiconductor packaging industry
• Ecosystem of semiconductor IC packaging industry

PART 06: Market landscape
• Market size and forecast
• Five forces analysis

PART 07: Market segmentation by application
• Global fan-in WLP market by application
• Analog and mixed ICs
• Wireless connectivity
• Logic and memory ICs
• MEMS and sensors
• CMOS image sensors

PART 08: Geographical segmentation
• Global fan-in WLP market by geography 2015-2020
• APAC
• North America
• Europe

PART 09: Market drivers
• High demand for miniaturized electronics
• Growing application of semiconductor ICs in IoT
• Increasing complexity of semiconductor IC designs
• Surging demand for semiconductor wafers

PART 10: Impact of drivers

PART 11: Market challenges
• Cyclical nature of semiconductor industry
• Rapid technological changes in wafer processing

PART 12: Impact of drivers and challenges

PART 13: Market trends
• Increase in wafer size
• High adoption of semiconductor ICs in automobiles
• Short replacement cycle of mobile devices

PART 14: Vendor landscape
• Competitive scenario
• Key vendors
• Other prominent vendors

PART 15: Market summary

PART 16: Appendix
• List of abbreviations

PART 17: Explore Technavio

[List of Exhibits]

Exhibit 01: Global fan-in WLP market segmentation 2015
Exhibit 02: Key regions
Exhibit 03: PEST analysis
Exhibit 04: Semiconductor IC manufacturing process
Exhibit 05: Front-end chip formation steps
Exhibit 06: Back-end chip formation steps
Exhibit 07: Roadmap of semiconductor packaging industry
Exhibit 08:.5D IC block diagram
Exhibit 09:D IC block diagram
Exhibit 10: Old semiconductor IC packaging industry supply chain
Exhibit 11: New semiconductor IC packaging industry supply chain
Exhibit 12: Global fan-in WLP market 2015-2020 ($ billions)
Exhibit 13: Global fan-in WLP market 2015-2020 (billions of units)
Exhibit 14: Five forces analysis
Exhibit 15: Global fan-in WLP market by application 2015-2020 (% share of shipments)
Exhibit 16: Global fan-in WLP market by application 2015-2020 (billions of units)
Exhibit 17: Global fan-in WLP market by analog and mixed IC 2015-2020 (billions of units)
Exhibit 18: Global fan-in WLP market by wireless connectivity 2015-2020 (billions of units)
Exhibit 19: Global fan-in WLP market by logic and memory IC 2015-2020 (billions of units)
Exhibit 20: Global fan-in WLP market by MEMS and sensors 2015-2020 (billions of units)
Exhibit 21: Global fan-in WLP market by CMOS image sensor 2015-2020 (billions of units)
Exhibit 22: Global fan-in WLP market by geography 2015-2020 (% share of shipment)
Exhibit 23: Global fan-in WLP market by geography 2015-2020 (billions of units)
Exhibit 24: Fan-in WLP market in APAC 2015-2020 (billions of units)
Exhibit 25: Fan-in WLP market in North America 2015-2020 (billions of units)
Exhibit 26: Fan-in WLP market in Europe 2015-2020 (billions of units)
Exhibit 27: Global MEMS market 2015-2020 ($ billions)
Exhibit 28: Global smartphone shipment forecast 2015-2020 (millions of units)
Exhibit 29: Impact of drivers
Exhibit 30: Impact of drivers (continued)
Exhibit 31: Global semiconductor market trend 1992-2014 ($ billions)
Exhibit 32: Impact of drivers and challenges
Exhibit 33: Timeline for semiconductor wafer-size advances
Exhibit 34: Growth of car shipments 2015-2020
Exhibit 35: Other prominent vendors in market
Exhibit 36: Market snapshot of global fan-in WLP market 2015-2020
Exhibit 37: CAGR comparison: Application segments
Exhibit 38: CAGR comparison: Geographical segments



【掲載企業】

STATS ChipPAC, STMicroelectronics, TSMC, Texas Instruments, Rudolph Technologies, SEMES, SUSS MicroTec, Ultratech, FlipChip International.

【資料のキーワード】

ファンインWLP、ウェハーレベルパッケージ、ウエハーレベルCSP、チップスケールパッケージング、半導体、電子部品、センサー

【調査方法】

一次資料による調査(業界専門家、ベンダー、代理店、顧客等を対象にしたデプスインタビュー調査など)及び二次資料による調査(Technavio独自のプラットフォーム、産業書籍、企業報告書、ニュース記事、アナリストレポート、貿易協会、政府機関発行データなど)

★調査レポート[ファンインWLP(ウェハーレベルパッケージ)の世界市場2016-2020] (Global Fan-in Wafer Level Packaging Market 2016-2020 / IRTNTR10665)販売に関する免責事項
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