Global System-in-Package Market 2016-2020

システム・イン・パッケージ(SiP)の世界市場2016-2020

◆タイトル:Global System-in-Package Market 2016-2020
◆商品コード:IRTNTR10639
◆調査・発行会社:Technavio (Infiniti Research Ltd.)
◆発行日:2016年10月19日
◆ページ数:67
◆資料形式:PDF / 英語
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◆調査対象地域:グローバル
◆産業分野:電子
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【資料の概要】

当調査レポートでは、システム・イン・パッケージ(SiP)の世界市場について調査・分析し、エグゼクティブサマリー、市場概観、市場概観、業界の構造分析、システム・イン・パッケージ(SiP)の世界市場規模及び予測、用途別分析、需要先別分析、地域別分析/市場規模、市場の成長要因、市場の課題、市場動向、競争状況などの情報をお届けいたします。

About SiPA SiP contains several chips such as a specialized processor, dynamic random access memory (DRAM), and flash memory. These chips are combined with passive components such as resistors and capacitors, which are placed on one substrate, requiring only a few external components to make it functional. Thus, devices packaged using this technology are ideal for space constrained environments such as smart devices. This reduces integration complexities on the printed circuit board (PCB) as well as making the overall design simpler.
Technavio’s analysts forecast the global SiP market to grow at a CAGR of 10.29% during the period 2016-2020.

[Covered in this report]
The report covers the present scenario and the growth prospects of the global SiP market for 2016-2020. To calculate the market size, the report considers the revenue generated from the sales of SiP systems.

The market is divided into the following segments based on geography:
• Americas
• APAC
• EMEA

Technavio’s report, Global SiP Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

[Key vendors]
• Amkor Technology
• ASE
• JCET
• SPIL
• UTAC

[Other prominent vendors]
• ChipMOS Technology
• ChipSiP Technology
• NANIUM
• Octavo Systems
• Samsung Electro-Mechanics

[Market driver]
• Need to control rising costs
• For a full, detailed list, view our report

[Market challenge]
• High inventory levels in supply chain
• For a full, detailed list, view our report

[Market trend]
• Growth of OSAT vendors
• For a full, detailed list, view our report

[Key questions answered in this report]
• What will the market size be in 2020 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?
• What are the market opportunities and threats faced by the key vendors?
• What are the strengths and weaknesses of the key vendors?

※You can request one free hour of our analyst’s time when you purchase this market report. Details are provided within the report.

【資料の目次】

PART 01: Executive summary
• Highlights

PART 02: Scope of the report
• Definition
• Source year and forecast period
• Market overview
• Segmentation
• Geographical coverage
• Vendor segmentation
• Common currency conversion rates
• Top-vendor offerings

PART 03: Market research methodology
• Research methodology
• Economic indicators

PART 04: Introduction
• Key market highlights

PART 05: Technology overview
• Back-end chip formation
• Wafer-level versus die-level packaging and assembly
• Evolution of semiconductor packaging industry
• Eco-system of semiconductor IC packaging industry

PART 06: Market landscape
• Market overview
• Comparison between SoC, SiP, and chip-on-board (CoB)
• Market size and forecast
• Five forces analysis

PART 07: Market segmentation by application
• Communications sector
• Consumer electronics sector
• Computers sector
• Automotive sector
• Medical sector

PART 08: Market segmentation by interconnect technology
• Wire bond packaging
• Flip-chip packaging

PART 09: Market segmentation by end-user
• Foundries
• IDMs

PART 10: Geographical segmentation
• APAC
• Americas
• EMEA

PART 11: Market drivers
• Need to control rising costs
• Emergence of advanced and compact consumer electronic devices
• Rise in number of fabs
• Increasing number of IoT devices
• Design complexities in SoC

PART 12: Impact of drivers

PART 13: Market challenges
• High inventory levels in supply chain
• Fluctuation of foreign exchange rates
• High investment market

PART 14: Impact of drivers and challenges

PART 15: Market trends
• Growth of OSAT vendors
• Emergence of FOWLP technology
• Automation in automobiles

PART 16: Vendor landscape
• Competitive scenario
• Key vendors
• Other prominent vendors

PART 17: Appendix
• List of abbreviations

PART 18: Explore Technavio

[List of Exhibits]

Exhibit 01: Global SiP market segmentation
Exhibit 02: List of countries in key geographies
Exhibit 03: Market vendors
Exhibit 04: Currency conversions
Exhibit 05: Product offerings
Exhibit 06: Back-end chip formation steps
Exhibit 07:.5D IC block diagram
Exhibit 08:D IC block diagram
Exhibit 09: Old semiconductor IC packaging industry supply chain
Exhibit 10: New semiconductor IC packaging industry supply chain
Exhibit 11: SoC, SiP, and CoB ranking on functioning parameters
Exhibit 12: Global SiP market 2015-2020 ($ billions)
Exhibit 13: Five forces analysis
Exhibit 14: Percentage share of SiP usage in applications (2015-2020)
Exhibit 15: Percentage share of SiP usage in applications 2015-2020 ($ billions)
Exhibit 16: Global SiP market for communications sector 2015-2020 ($ billions)
Exhibit 17: Global SiP market for consumer electronics sector 2015-2020 ($ billions)
Exhibit 18: Global SiP market for computer sector 2015-2020 ($ billions)
Exhibit 19: Global SiP market for automotive sector 2015-2020 ($ billions)
Exhibit 20: Expected automotive shipment forecast y-o-y (%)
Exhibit 21: Global SiP market for medical sector 2015-2020 ($ billions)
Exhibit 22: Bonding technologies for SiP, 2015-2020 (% share)
Exhibit 23: Bonding technologies for SiP, 2015-2020 ($ billions)
Exhibit 24: Global SiP market for wire bond packaging 2015-2020 ($ billions)
Exhibit 25: Global SiP market for flip-chip packaging 2015-2020 ($ billions)
Exhibit 26: Global SiP market by end-user 2015-2020 (% share)
Exhibit 27: Global SiP market by end-user 2015-2020 ($ billions)
Exhibit 28: Global SiP market of foundries 2015-2020 ($ billions)
Exhibit 29: Global SiP market for IDMs 2015-2020 ($ billions)
Exhibit 30: Global SiP market by geography 2015-2020 (% share)
Exhibit 31: Global SiP market by geography 2015-2020 (% share)
Exhibit 32: SiP market in APAC 2015-2020 ($ billions)
Exhibit 33: SiP market in Americas 2015-2020 ($ billions)
Exhibit 34: SiP market in EMEA 2015-2020 ($ billions)
Exhibit 35: Impact of drivers
Exhibit 36: Global semiconductor market trend 1992-2015 ($ billions)
Exhibit 37: Impact of drivers and challenges
Exhibit 38: Other vendors in global SiP market



【掲載企業】

Amkor Technology, ASE, JCET, SPIL, UTAC, ChipMOS Technology, ChipSiP Technology, NANIUM, Octavo Systems, Samsung Electro-Mechanics.

【資料のキーワード】

システムインパッケージ(SiP)、通信、家電製品、パソコン、自動車、医療、SiP用途、ワイヤボンド実装、フリップチップ実装

【調査方法】

一次資料による調査(業界専門家、ベンダー、代理店、顧客等を対象にしたデプスインタビュー調査など)及び二次資料による調査(Technavio独自のプラットフォーム、産業書籍、企業報告書、ニュース記事、アナリストレポート、貿易協会、政府機関発行データなど)

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