調査レポートカテゴリー： Infiniti Research TechNavio, IT/電子, 世界

Global Semiconductor Packaging Materials Market 2016-2020

半導体パッケージング材料の世界市場：有機基板、ボンディングワイヤー、リードフレーム、封止樹脂、セラミックパッケージ、ダイアタッチ材、半田ボール

◆タイトル：Global Semiconductor Packaging Materials Market 2016-2020
◆商品コード：IRTNTR9245
◆調査・発行会社：Technavio (Infiniti Research Ltd.)
◆発行日：2016年4月18日
◆ページ数：112
◆資料形式：PDF / 英語
◆納品方法：Eメール（受注後24時間以内）
◆調査対象地域：グローバル
◆産業分野：電子
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【資料の概要】

当調査レポートでは、半導体パッケージング材料の世界市場について調査・分析し、エグゼクティブサマリー、市場概観、市場概観、業界の構造分析、半導体パッケージング材料の世界市場規模及び予測、種類別分析、地域別分析/市場規模、主要国別分析、市場の成長要因、市場の課題、市場動向、競争状況、主要企業（ベンダー）分析などの情報をお届けいたします。

About Semiconductor Packaging Materials
Semiconductor packages are metal, plastic, and ceramic components which not only protect the fabricated IC on the semiconductor die but also acts as an interconnect between the die and the PCB (printed circuit board). They protect the die from external mechanical impact and corrosion, and also act as electrically conductive interconnects with excellent signal propagation properties. Excess heat in the circuit is not allowed to build up by dissipation through attached heat spreaders. Packaging components vary in dimensions and functionality and mainly are organic substrates, leadframes, bonding wires, encapsulation resins, die attach materials, solder balls, and thermal interface materials, among others. The key customers of these packaging material are fabless semiconductor companies, packaging material suppliers, packaging subcontractors, semiconductor manufacturers, the electronics industry, and the automotive sector.

Technavio’s analysts forecast the global semiconductor packaging materials market to grow at a CAGR of 4.79% during the period 2016-2020.

[Covered in this report]
The report covers the present scenario and the growth prospects of the global semiconductor packaging materials market for the period 2016-2020. To calculate the market size and geographical segmentation, the report considers the revenue generated from the sales of different types of packaging based on the type of material, which can be broadly classified as either leadframe based or laminate substrate based.

The market is divided into the following segments based on geography:
• Americas
• APAC
• EMEA

Technavio’s report, Global Semiconductor Packaging Materials Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

[Key vendors]
• Amkor Technology
• DuPont
• Henkel
• Hitachi Chemical
• Honeywell
• KYOCERA
• Toppan Printing

[Other prominent vendors]
• Alpha Advanced Materials
• Applied Materials
• ASM Pacific Technology (ASMPT)
• BASF
• Beijing Doublink Solders
• Beijing Kehua New Chemical Technology
• Cheil Industries
• Duksan Hi-metal
• Diehl Metall
• Dynacraft
• Evergreen Semiconductor Materials
• Guangdong Rongtai
• Heesung Metal
• Heraeus
• Ibiden
• Indium
• IQE
• KCC
• LG Innotek
• Lintec
• Lord
• Mitsui High-Tec
• MK Electron
• Nanya PCB
• Ningbo Dongsheng IC
• Nippon Micrometal
• Nitto Denko
• Poongsan
• Samsung Techwin
• Shinko
• Shin-Etsu Chemical
• Shanghai Sinyang Semiconductor Materials
• Sumitomo Metal Mining
• Tanaka Denshi Kogyo
• Tatsuta Electronic Materials
• Xiamen Yonghong Electronics

[Market driver]
• Rising demand for polymer adhesive wafer bonding equipment
• For a full, detailed list, view our report

[Market challenge]
• Fluctuating foreign exchange rates
• For a full, detailed list, view our report

[Market trend]
• Rapid technological changes
• For a full, detailed list, view our report

[Key questions answered in this report]
• What will the market size be in 2020 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?
• What are the market opportunities and threats faced by the key vendors?
• What are the strengths and weaknesses of the key vendors?

※You can request one free hour of our analyst’s time when you purchase this market report. Details are provided within the report.

【資料の目次】

PART 01: Executive summary
• Highlights

PART 02: Scope of the report
• Market overview
• Top-vendor offerings

PART 03: Market research methodology
• Research methodology
• Economic indicators

PART 04: Introduction
• Key market highlights

PART 05: Technology landscape
• Semiconductor packaging and assembly
• Wafer-level versus die-level packaging and assembly
• Roadmap of the semiconductor packaging industry
• Ecosystem of semiconductor IC packaging industry

PART 06: Semiconductor packaging technology
• Small outline (SO) packages
• Grid array (GA) packages
• Flat no-leads packages
• Quad flat packages (QFP)
• Dual in-line package (DIP)
• Other technologies

PART 07: Market landscape
• Market overview
• Market size and forecast
• PEST analysis
• Five forces analysis

PART 08: Market segmentation by type of material
• Global semiconductor packaging materials market by type of material 2015-2020
• Global organic substrates market
• Global bonding wires market
• Global leadframes market
• Global encapsulation resins market
• Global ceramic packages market
• Global die attach materials market
• Global solder balls market
• Global other semiconductor packaging materials market

PART 09: Geographical segmentation
• Global semiconductor packaging materials market geographically 2015-2020
• Semiconductor packaging materials market in APAC
• Semiconductor packaging materials market in North America
• Semiconductor packaging materials market in Europe

PART 10: Key leading countries
• Taiwan
• China
• Japan

PART 11: Market drivers

PART 12: Impact of drivers

PART 13: Market challenges

PART 14: Impact of drivers and challenges

PART 15: Market trends

PART 16: Vendor landscape
• Competitive scenario

PART 17: Key vendor analysis
• Amkor Technology
• DuPont
• Henkel
• Hitachi Chemical
• Honeywell International
• Kyocera
• Toppan Printing
• Other prominent vendors

PART 18: Appendix
• List of abbreviations

PART 19: Explore Technavio

[List of Exhibits]

Exhibit 01: Product offerings
Exhibit 02: Steps in back-end chip formation
Exhibit 03: Old supply chain of semiconductor IC packaging industry
Exhibit 04: New supply chain of semiconductor IC packaging industry
Exhibit 05: Semiconductor packaging materials technologies
Exhibit 06: Global semiconductor packaging materials market landscape
Exhibit 07: Global semiconductor packaging materials market 2015-2020 ($ billion)
Exhibit 08: Five forces analysis
Exhibit 09: Global semiconductor packaging materials market by type of material 2015 and 2020 (revenue %)
Exhibit 10: Global semiconductor packaging materials market by type of material 2015-2020 (revenue %)
Exhibit 11: Global semiconductor packaging materials market by type of material 2015-2020 ($ billion)
Exhibit 12: Global organic substrates market 2015-2020 ($ billion)
Exhibit 13: Global bonding wires market 2015-2020 ($ billion)
Exhibit 14: Global leadframes market 2015-2020 ($ billion)
Exhibit 15: Global encapsulation resins market 2015-2020 ($ billion)
Exhibit 16: Global ceramic packages market 2015-2020 ($ billion)
Exhibit 17: Global die attach materials market 2015-2020 ($ billion)
Exhibit 18: Die attach materials by type 2015 (revenue %)
Exhibit 19: Global solder balls market 2015-2016 ($ billion)
Exhibit 20: Global other semiconductor packaging materials market 2015-2020 ($ billion)
Exhibit 21: Five forces analysis by geography
Exhibit 22: Global semiconductor packaging materials market by geography 2015 and 2020 (revenue %)
Exhibit 23: Global semiconductor packaging materials market by geography 2015-2020 (revenue %)
Exhibit 24: Global semiconductor packaging materials market by geography 2015-2020 ($ billion)
Exhibit 25: Semiconductor packaging materials market in APAC 2015-2020 ($ billion)
Exhibit 26: Semiconductor packaging materials market in North America 2015-2020 ($ billion)
Exhibit 27: Semiconductor packaging materials market in Europe 2015-2020 ($ billion)
Exhibit 28: Key leading countries in 2015
Exhibit 29: Global MEMS market 2015-2020 ($ billion)
Exhibit 30: Impact of drivers
Exhibit 31: Global semiconductor capital equipment market by geography 2014 and 2015 ($ billion)
Exhibit 32: Impact of drivers and challenges
Exhibit 33: Global NAND flash market 2015-2020 (revenue %)
Exhibit 34: Global car shipments 2015-2020 (shipment growth %)
Exhibit 35: Amkor Technology: Product segmentation by revenue 2015
Exhibit 36: Amkor Technology: Geographical segmentation by revenue 2015
Exhibit 37: DuPont: Segmentation of revenue by business 2015
Exhibit 38: DuPont: Geographical segmentation by revenue 2015
Exhibit 39: Henkel: Business segmentation by revenue 2015
Exhibit 40: Henkel: Geographical segmentation by revenue 2015
Exhibit 41: Hitachi Chemical: Business segmentation by revenue 2015
Exhibit 42: Hitachi Chemical: Geographical segmentation by revenue 2015
Exhibit 43: Honeywell International: Business segmentation by revenue 2015
Exhibit 44: Honeywell International: Geographical segmentation by revenue by 2015
Exhibit 45: Kyocera: Business segmentation by revenue 2015
Exhibit 46: Kyocera: Geographical segmentation by revenue 2015
Exhibit 47: Toppan Printing: Business segmentation by revenue 2015
Exhibit 48: Toppan Printing: Geographical segmentation by revenue 20150

【掲載企業】

Amkor Technology, DuPont, Henkel, Hitachi Chemical, Honeywell, KYOCERA, Toppan Printing, Alpha Advanced Materials, Applied Materials, ASM Pacific Technology (ASMPT), BASF, Beijing Doublink Solders, Beijing Kehua New Chemical Technology, Cheil Industries, Duksan Hi-metal, Diehl Metall, Dynacraft, Evergreen Semiconductor Materials, Guangdong Rongtai, Heesung Metal, Heraeus, Ibiden, Indium, IQE, KCC, LG Innotek, Lintec, Lord, Mitsui High-Tec, MK Electron, Nanya PCB, Ningbo Dongsheng IC, Nippon Micrometal, Nitto Denko, Poongsan, Samsung Techwin, Shinko, Shin-Etsu Chemical, Shanghai Sinyang Semiconductor Materials, Sumitomo Metal Mining, Tanaka Denshi Kogyo, Tatsuta Electronic Materials, Xiamen Yonghong Electronics.

【資料のキーワード】

半導体パッケージング、パッケージング材料、有機基板、ボンディングワイヤー、リードフレーム、封止樹脂、セラミックパッケージ、ダイアタッチ材、半田ボール、パッケージング技術

【調査方法】

一次資料による調査（業界専門家、ベンダー、代理店、顧客等を対象にしたデプスインタビュー調査など）及び二次資料による調査（Technavio独自のプラットフォーム、産業書籍、企業報告書、ニュース記事、アナリストレポート、貿易協会、政府機関発行データなど）

★調査レポート[半導体パッケージング材料の世界市場：有機基板、ボンディングワイヤー、リードフレーム、封止樹脂、セラミックパッケージ、ダイアタッチ材、半田ボール] (Global Semiconductor Packaging Materials Market 2016-2020 / IRTNTR9245)販売に関する免責事項

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