Global Semiconductor Packaging and Assembly Equipment Market 2016-2020

半導体パッケージング及び組立装置の世界市場2016-2020

◆タイトル:Global Semiconductor Packaging and Assembly Equipment Market 2016-2020
◆商品コード:IRTNTR7971
◆調査・発行会社:Technavio (Infiniti Research Ltd.)
◆発行日:2016年1月20日
◆ページ数:67
◆資料形式:PDF / 英語
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【資料の概要】

当調査レポートでは、半導体パッケージング及び組立装置の世界市場について調査・分析し、エグゼクティブサマリー、市場概観、市場概観、業界の構造分析、半導体パッケージング及び組立装置の世界市場規模及び予測、種類別分析、地域別分析/市場規模、市場の成長要因、市場の課題、市場動向、競争状況、主要企業(ベンダー)分析などの情報をお届けいたします。

About Semiconductor Packaging and Assembly Equipment

For an integrated chip (IC) to function, it needs to be connected to the package or connected directly to the printed circuit. This involves dicing, wire bonding, and die bonding. This entire process is known as semiconductor packaging and assembly, which is the back-end process of chip formation. The increasing application of semiconductor ICs across many segments has increased the demand for semiconductor packaging and assembly equipment.

Technavio’s analysts forecast the global semiconductor packaging and assembly equipment market to grow at a CAGR of 4.68% during the period 2016-2020.

[Covered in this report]
The report covers the present scenario and the growth prospects of the global semiconductor packaging and assembly equipment market for 2016-2020. To calculate the market size, the report considers the revenue generated from the sale of die-level and wafer-level packaging and assembly equipment to semiconductor manufacturers.

The market is divided into the following segments based on type:
• Die- level packaging and assembly equipment
• Wafer-level packaging and assembly equipment

Technavio’s report, Global Semiconductor Packaging and Assembly Equipment Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

[Key vendors]
• Applied Materials
• ASMPT
• DISCO
• EVG
• Kulicke and Soffa Industries
• TEL
• Tokyo Seimitsu

[Other prominent vendors]
• Rudolph Technologies
• SEMES
• Suss Microtec
• Ultratech
• Ulvac Technologies

[Market driver]
• Rising demand for polymer adhesive wafer bonding equipment
• For a full, detailed list, view our report

[Market challenge]
• Fluctuating foreign exchange rates
• For a full, detailed list, view our report

[Market trend]
• Higher number of mergers and acquisitions (M&A)
• For a full, detailed list, view our report

[Key questions answered in this report]
• What will the market size be in 2020 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?
• What are the market opportunities and threats faced by the key vendors?
• What are the strengths and weaknesses of the key vendors?

※You can request one free hour of our analyst’s time when you purchase this market report. Details are provided within the report.

【資料の目次】

PART 01: Executive summary
• Highlights

PART 02: Scope of the report
• Market overview
• Top-vendor offerings

PART 03: Market research methodology
• Research methodology
• Economic indicators
• PEST analysis

PART 04: Introduction
• Key market highlights
• Market perspective

PART 05: Technology landscape
• Back-end chip formation
• Wafer-level versus die-level packaging and assembly
• Roadmap of the semiconductor packaging industry
• Ecosystem of semiconductor IC packaging industry

PART 06: Market landscape
• Consumer perspective
• Market size and forecast
• Five forces analysis

PART 07: Market segmentation by type
• Market overview
• Market size and forecast

PART 08: Geographical segmentation
• Market overview
• Global semiconductor packaging and assembly equipment market in APAC
• Global semiconductor packaging and assembly equipment market in North America
• Global semiconductor packaging and assembly equipment market in Europe

PART 09: Market drivers and their impact
• Rising demand for polymer adhesive wafer bonding equipment
• Growing application of semiconductor ICs in the IoT
• Growing demand for semiconductor ICs
• Increasing complexity of semiconductor IC designs
• Increasing miniaturization of electronic devices

PART 10: Market challenges
• Fluctuating foreign exchange rates
• Heavy investment required
• Cyclical nature of the semiconductor industry

PART 11: Impact of drivers and challenges

PART 12: Market trends
• Higher number of M&A
• Rapid technological changes in the semiconductor industry
• High adoption of semiconductor ICs in automobiles

PART 13: Vendor landscape
• Competitive scenario
• Key vendors
• Other prominent vendors

PART 14: Key vendor analysis
• Applied Materials
• ASM Pacific Technology (ASMPT)
• Disco
• EV Group (EVG)
• Kulicke and Soffa Industries
• Tokyo Electron Ltd. (TEL)
• Tokyo Seimitsu

PART 15: Key suggestions for investors/vendors

PART 16: Appendix
• List of abbreviations

PART 17: Explore Technavio

[List of Exhibits]

Exhibit 01: Global semiconductor packaging and assembly equipment market segmentation
Exhibit 02: Product offerings
Exhibit 03: Steps in back-end chip formation
Exhibit 04: 2.5D IC block diagram
Exhibit 05: 3D IC block diagram
Exhibit 06: Old supply chain of semiconductor IC packaging industry
Exhibit 07: New supply chain of semiconductor IC packaging industry
Exhibit 08: Global semiconductor packaging and assembly equipment market 2015-2020 ($ billions)
Exhibit 09: Five forces analysis
Exhibit 10: Global semiconductor packaging and assembly equipment market 2015
Exhibit 11: Global semiconductor packaging and assembly equipment market 2015-2020 (% share)
Exhibit 12: Global semiconductor packaging and assembly equipment market 2015-2020 ($ billions)
Exhibit 13: Global semiconductor packaging and assembly equipment market 2015
Exhibit 14: Global semiconductor packaging and assembly equipment market in APAC ($ billions)
Exhibit 15: Global semiconductor packaging and assembly equipment market in North America ($ billions)
Exhibit 16: Global semiconductor packaging and assembly equipment market in Europe ($ millions)
Exhibit 17: Impact of drivers on key customer segments
Exhibit 18: Global MEMS market 2015-2020 ($ billions)
Exhibit 19: Global semiconductor market trend 1992-2014 ($ billions)
Exhibit 20: Impact of drivers and challenges
Exhibit 21: Global NAND flash market 2015-2020 (% share)
Exhibit 22: Global car shipments 2015-2020 (shipment growth)
Exhibit 23: Applied Materials: Geographical segmentation by revenue 2014
Exhibit 24: ASMPT: Geographical segmentation by revenue 2014
Exhibit 25: Disco: Geographical segmentation by revenue 2014
Exhibit 26: Kulicke and Soffa Industries: Geographical segmentation by revenue 2014
Exhibit 27: TEL: Geographical segmentation by revenue 2015
Exhibit 28: TEL: Business performance by revenue 2012-2015
Exhibit 29: Tokyo Seimitsu: Geographical segmentation by revenue 2014
Exhibit 30: Tokyo Seimitsu: Business segmentation by revenue 2013-2015 ($ millions)



【掲載企業】

Applied Materials, ASMPT, DISCO, EVG, Kulicke and Soffa Industries, TEL, Tokyo Seimitsu, Rudolph Technologies, SEMES, Suss Microtec, Ultratech, Ulvac Technologies.

【資料のキーワード】

半導体パッケージング装置、半導体組立装置、半導体装置

【調査方法】

一次資料による調査(業界専門家、ベンダー、代理店、顧客等を対象にしたデプスインタビュー調査など)及び二次資料による調査(Technavio独自のプラットフォーム、産業書籍、企業報告書、ニュース記事、アナリストレポート、貿易協会、政府機関発行データなど)

★調査レポート[半導体パッケージング及び組立装置の世界市場2016-2020] (Global Semiconductor Packaging and Assembly Equipment Market 2016-2020 / IRTNTR7971)販売に関する免責事項
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