Global 3D IC Market 2015-2019

3D ICの世界市場:メモリ、センサ、MEMS、LED

◆タイトル:Global 3D IC Market 2015-2019
◆商品コード:IRTNTR8075
◆調査・発行会社:Technavio (Infiniti Research Ltd.)
◆発行日:2015年12月9日
◆ページ数:69
◆資料形式:pdf / 英語
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◆調査対象地域:グローバル
◆産業分野:電子
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【資料の概要】

当調査レポートでは、3D ICの世界市場について調査・分析し、エグゼクティブサマリー、市場概観、市場概観、業界の構造分析、3D ICの世界市場規模及び予測、製品別分析、地域別分析/市場規模、市場の成長要因、市場の課題、市場動向、競争状況、主要企業(ベンダー)分析などの情報をお届けいたします。

Technavio’s research analyst predicts the global 3D IC market to grow at a CAGR above 79% during the forecast period. The demand for compact and high-performance ICs in smartphones, tablet PCs, smart TVs, automotive products, and heavy equipment is the primary growth driver for this market. In comparison to 2D ICs, they have better performance and high bandwidth. Moreover, 3D ICs have a lesser number of interconnections between the packages, consumes less power, and require less space on electronic boards.

The high proliferation of IoT devices is expected to boost the market growth during the forecast period. Vendors in IoT market are constantly innovating in designing, manufacturing, and packaging. This enables them to come up with new IoT products in different verticals such as consumer electronics, healthcare, and manufacturing. 3D MEMS and sensors are used to capture data in a real-time scenario, which helps the company in increasing the returns by streamlining the process, increasing productivity, and enabling predictive maintenance. They also reduce the maintenance cost and the possibility of a sudden stop of work due to machinery failure.

Product segmentation and analysis of the 3D IC market
• Memories
• Sensors
• MEMS
• LEDs

The memory product segment dominated the market during 2014, with a market share of over 62%. Technological advances such as high storage capacity and less power consumption are increasing the adoption of 3D NAND and DDR4 DRAM in smartphones, tablet PCs, consumer electronics, and automotive products, thereby driving the growth of the 3D memory chips.

Geographical segmentation and analysis of the 3D IC market
• Americas
• APAC
• EMEA

APAC accounted for 52% of the market share during 2014 and is expected to grow at a CAGR of 86% during the forecast period. The high growth in memory product segment and presence of several prominent manufacturers in the mobile and consumer electronics market such as Xiaomi, Samsung, LG, HTC, ZTE, Huawei, Lenovo, and Sony is expected to create a high demand for 3D ICs in the region during the forecast period.

The global 3D IC market is at the nascent stage and manufacturers are aiming for the first mover advantage by making an early entry into the market. The vendors in the market compete on the basis of price, quality, innovation, and technology. Collaborations between OSAT, IDMs, and OEMs is expected to bring down the cost of 3D ICs in the coming years.

The leading vendors in the market are –
• Advanced Semiconductor Engineering (ASE)
• Samsung
• STMicroelectronics
• Taiwan Semiconductors Manufacturing (TSMC)
• Toshiba

【資料の目次】

PART 01: Executive summary
• Highlights

PART 02: Scope of the report
• Market overview
• Top-vendor offerings

PART 03: Market research methodology
• Research methodology
• Economic indicators
• PEST analysis

PART 04: Introduction
• Key market highlights

PART 05: Market landscape
• Industry overview
• Technology landscape
• Ecosystem of 3D ICs
• Market overview
• Market size and forecast
• Five forces analysis

PART 06: Market segmentation by product types
• Market overview
• Market size and forecast

PART 07: Geographical segmentation
• Market overview
• Market size and forecast

PART 08: Market drivers
• Impact of drivers

PART 09: Market challenges

PART 10: Impact of drivers and challenges

PART 11: Market trends

PART 12: Vendor landscape
• Competitive scenario
• Key vendors
• Other prominent vendors

PART 13: Key vendor analysis
• ASE
• Samsung Electronics
• STMicroelectronics
• TSMC
• Toshiba

PART 14: Key recommendations for vendors/investors

PART 15: Appendix
• List of abbreviations

PART 16: Explore Technavio

[List of Exhibits]

Exhibit 01: Global 3D IC market segments: A snapshot
Exhibit 02: Product offerings
Exhibit 03: Global semiconductor market overview 2014
Exhibit 04: 2.5D IC block diagram
Exhibit 05: 3D IC block diagram
Exhibit 06: Global semiconductor market (% share)
Exhibit 07: Global 3D IC market 2014-2019 ($ billions)
Exhibit 08: Five forces analysis
Exhibit 09: Global 3D IC market by products 2014 (% share)
Exhibit 10: Global 3D IC market 2014-2019 by products (% share)
Exhibit 11: Global 3D IC market 2014-2019 by products ($ billions)
Exhibit 12: Global 3D IC market by geography 2014 (% share)
Exhibit 13: Global 3D IC market by geography 2014-2019 (% share)
Exhibit 14: Global 3D IC market by geography 2014-2019 ($ billions)
Exhibit 15: CAGR of global 3D IC market by geography 2014-2019
Exhibit 16: Impact of market drivers on key customer segments
Exhibit 17: IoT spending and device penetration
Exhibit 18: Impact of drivers and challenges
Exhibit 19: ASE: Business segmentation 2014 by revenue
Exhibit 20: ASE: Business segmentation by revenue 2013 and 2014 (in billions)
Exhibit 21: ASE: Geographical segmentation by revenue 2013
Exhibit 22: Samsung Electronics: Business segmentation 2013
Exhibit 23: Samsung Electronics: Business segmentation by revenue 2013 and 2014 ($ billions)
Exhibit 24: Samsung Electronics: Geographical segmentation by revenue 2014
Exhibit 25: STMicroelectronics: Business segmentation 2014 by revenue
Exhibit 26: STMicroelectronics: Business segmentation by revenue 2013 and 2014 ($ in billions)
Exhibit 27: STMicroelectronics: Geographical segmentation by revenue 2014
Exhibit 28: TSMC: Business segmentation by revenue 2014
Exhibit 29: TSMC: Business segmentation by revenue 2013 and 2014 ($ billions)
Exhibit 30: TSMC: Geographical segmentation by revenue 2014



【掲載企業】

Advanced Semiconductor Engineering (ASE), Samsung, STMicroelectronics, Taiwan Semiconductors Manufacturing (TSMC), Toshiba, Intel, Micron, SanDisk, SK Hynix, STATS ChipPAC, United Microelectronics, Xilinx.

【資料のキーワード】

3D IC、電子部品、メモリ、センサ、MEMS、LED

【調査方法】

一次資料による調査(業界専門家、ベンダー、代理店、顧客等を対象にしたデプスインタビュー調査など)及び二次資料による調査(Technavio独自のプラットフォーム、産業書籍、企業報告書、ニュース記事、アナリストレポート、貿易協会、政府機関発行データなど)

★調査レポート[3D ICの世界市場:メモリ、センサ、MEMS、LED] (Global 3D IC Market 2015-2019 / IRTNTR8075)販売に関する免責事項
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