Global Wafer-level Packaging Equipment Market 2015-2019

ウェハレベルパッケージング装置の世界市場2015-2019

◆タイトル:Global Wafer-level Packaging Equipment Market 2015-2019
◆商品コード:IRTNTR5108
◆調査・発行会社:Technavio (Infiniti Research Ltd.)
◆発行日:2015年1月21日
◆ページ数:85
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【資料の概要】

当調査レポートでは、ウェハレベルパッケージング装置の世界市場について調査・分析し、エグゼクティブサマリー、市場概観、業界の構造分析、ウェハレベルパッケージング装置の世界市場規模及び予測、市場シェア、地域別分析、主要国別分析、購買基準、市場成長要因、市場の課題、市場動向、競争状況、主要企業(ベンダー)分析などの情報をお届けいたします。

About Wafer-level Packaging Equipment
ICs are very delicate in nature, therefore, prone to contamination that can cause malfunctioning. To eliminate such issues, silicon chips or ICs are protected by using packaging materials. Wafer level packaging is one such type of packaging, which involves the packaging of individual ICs using best fit packaging processes conducted at wafer level manufacturing in semiconductor production process.

TechNavio’s analysts forecast the Global Wafer-level Packaging Equipment market to grow at a CAGR of 0.1 percent over the period 2014-2019.

[Covered in this Report]
This report covers the present scenario and the growth prospects of the Global Wafer-level Packaging Equipment market for the period 2015-2019. This report considers 2014 as the base year and provides data for the trailing 12 months. To calculate the market size, the report considers revenue generated from the sales of wafer-level packaging equipment worldwide. However, the report does not take into consideration the following while calculating the market size:
• Support or maintenance services that are offered for/with wafer-level packaging equipment
• Components that are used in the production of wafer-level packaging equipment
• Aftermarket sales of wafer-level packaging equipment

[Key Regions]
• Americas
• APAC
• EMEA

[Key Vendors]
• Applied Materials
• Disco
• EV Group
• Tokyo Electron
• Tokyo Seimitsu

[Other Prominent Vendors]
• Rudolph Technologies
• SEMES
• Suss Microtec
• Ultratech
• ULVAC

[Market Driver]
• Increased Demand for Smartphones and Tablets
• For a full, detailed list, view our report

[Market Challenge]
• Rapid Changes in Technology
• For a full, detailed list, view our report

[Market Trend]
• Short Replacement Cycle of Portable Electronic Devices
• For a full, detailed list, view our report

[Key Questions Answered in this Report]
• What will the market size be in 2019 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?
• What are the market opportunities and threats faced by the key vendors?
• What are the strengths and weaknesses of the key vendors?

【資料の目次】

01. Executive Summary

02.List of Abbreviations

03.Scope of the Report
03.1 Market Overview
03.2 Product Offerings

04.Market Research Methodology
04.1 Market Research Process
04.2 Research Methodology

05.Introduction

06.Industry Overview
06.1 Semiconductor Industry Overview
06.1.1 Semiconductor Value Chain
06.2 Structure of Semiconductor Market
06.3 Global Semiconductor Market Overview
06.3.1 Geographical Segmentation of Semiconductor Market 2005-2012

07.Market Landscape
07.1 Market Size and Forecast
07.2 Five Forces Analysis

08.Geographical Segmentation
08.1 Global Wafer-level Packaging Equipment Market by Geographical Segmentation 2014-2019
08.2 Global Wafer-level Packaging Equipment Market by Geographical Segmentation 2014-2019 (percentage share and revenue split)
08.3 Wafer-level Packaging Equipment Market in APAC Region
08.3.1 Market Size and Forecast
08.4 Wafer-level Packaging Equipment Market in Americas
08.4.1 Market Size and Forecast
08.5 Wafer-level Packaging Equipment Market in EMEA Region
08.5.1 Market Size and Forecast

09.Key Leading Countries
09.1 Taiwan
09.2 South Korea
09.3 US

10.Buying Criteria

11.Market Growth Drivers

12.Drivers and their Impact

13.Market Challenges

14.Impact of Drivers and Challenges

15.Market Trends

16.Trends and their Impact

17.Vendor Landscape
17.1 Competitive Scenario
17.2 Market Share Analysis 2014
17.3 Other Prominent Vendors

18.Key Vendor Analysis
18.1 Applied Materials
18.1.1 Key Facts
18.1.2 Business Overview
18.1.3 Business Segmentation by Revenue 2013
18.1.4 Business Segmentation by Revenue 2011-2013
18.1.5 Geographical Segmentation by Revenue 2013
18.1.6 Business Strategy
18.1.7 Recent Developments
18.1.8 SWOT Analysis
18.2 DISCO
18.2.1 Key Facts
18.2.2 Business Overview
18.2.3 Product Segmentation by Revenue 2013
18.2.4 Product Segmentation by Revenue 2012 and 2013
18.2.5 Geographical Segmentation by Revenue 2013
18.2.6 Business Strategy
18.2.7 Recent Developments
18.2.8 SWOT Analysis
18.3 EV
18.3.1 Key Facts
18.3.2 Business Overview
18.3.3 Product Segmentation 2013
18.3.4 Recent Developments
18.3.5 SWOT Analysis
18.4 Tokyo Electron
18.4.1 Key Facts
18.4.2 Business Overview
18.4.3 Business Segmentation by Revenue 2013
18.4.4 Business Segmentation by Revenue 2011-2013
18.4.5 Geographical Segmentation by Revenue 2013
18.4.6 Business Strategy
18.4.7 Recent Developments
18.4.8 SWOT Analysis
18.5 Tokyo Seimitsu
18.5.1 Key Facts
18.5.2 Business Overview
18.5.3 Product Segmentation by Revenue 2013
18.5.4 Product Segmentation by Revenue 2012 and 2013
18.5.5 Geographical Segmentation by Revenue 2013
18.5.6 Business Strategy
18.5.7 Recent Developments
18.5.8 SWOT Analysis

19.Market Summary
19.1 Growth Propellers
19.1.1 Expansion Plans
19.1.2 Replacement of Old Equipment
19.2 Growth Inhibitor
19.2.1 Cyclic Nature of Semiconductor Industry
19.2.2 Rapid Advances in Technology
19.3 Ongoing Trends
19.3.1 Increasing Number of Innovations
19.3.2 Increasing Penetration of Clean Energy Devices
19.3.3 Increasing Focus on Improving Production Yield
19.3.4 Increasing Adoption of Semiconductors in Automotive Sector
19.4 Market Attractiveness

20.Other Reports in this Series

[List of Exhibits]

Exhibit 1: Market Research Methodology
Exhibit 2: Semiconductor Value Chain
Exhibit 3: Front-end Process
Exhibit 4: Back-end Process
Exhibit 5: Structure of Semiconductor Market
Exhibit 6: Global Semiconductor Market 2014
Exhibit 7: Global Semiconductor Market by Geographical Segmentation 2005-2012
Exhibit 8: Global Wafer-level Packaging Equipment Market 2013-2018 (US$ million)
Exhibit 9: Global Wafer-level Packaging Equipment Market by Geographical Segmentation 2014
Exhibit 10: Global Wafer-level Packaging Equipment Market by Geographical Segmentation 2014-2019 (percentage share)
Exhibit 11: Global Wafer-level Packaging Equipment Market by Geographical Segmentation 2014-2019 (US$ million)
Exhibit 12: Comparison of Geographies by CAGR 2014-2019
Exhibit 13: Wafer-level Packaging Equipment Market in Taiwan 2014-2019 (US$ million)
Exhibit 14: Wafer-level Packaging Equipment Market in South Korea 2014-2019 (US$ million)
Exhibit 15: Wafer-level Packaging Equipment Market in US 2014-2019 (US$ million)
Exhibit 16: CAGR Comparison between Key Leading Countries 2014-2019
Exhibit 17: Global Smartphone Market by Unit Shipments 2013-2019 (billion units)
Exhibit 18: Global Tablets Market by Unit Shipments 2013-2019 (million units)
Exhibit 19: Global Wafer-level Packaging Equipment Market by Vendor Ranking 2014
Exhibit 20: Applied Materials: Business Segmentation by Revenue 2013
Exhibit 21: Applied Materials: Business Segmentation by Revenue 2011-2013 (US$ million)
Exhibit 22: Applied Materials: Geographical Segmentation by Revenue 2013
Exhibit 23: DISCO: Product Segmentation by Revenue 2013
Exhibit 24: DISCO: Product Segmentation by Revenue 2012 and 2013 (US$ million)
Exhibit 25: DISCO: Geographical Segmentation by Revenue 2013
Exhibit 26: EV: Product Segmentation 2013
Exhibit 27: Tokyo Electron: Business Segmentation by Revenue 2013
Exhibit 28: Tokyo Electron: Business Segmentation by Revenue 2011-2013 (US$ million)
Exhibit 29: Tokyo Electron: Geographical Segmentation by Revenue 2013
Exhibit 30: Tokyo Seimitsu: Business Segmentation by Revenue 2013
Exhibit 31: Tokyo Seimitsu: Business Segmentation by Revenue 2011-2013 (US$ million)
Exhibit 32: Tokyo Seimitsu: Geographical Segmentation by Revenue 2013



【掲載企業】

Applied Materials, Disco , EV Group, Tokyo Electron , Tokyo Seimitsu , Rudolph Technologies , SEMES , Suss Microtec , Ultratech , ULVAC

【資料のキーワード】

ウェハレベルパッケージング装置、半導体

【調査方法】

一次資料による調査(業界専門家、ベンダー、代理店、顧客等を対象にしたデプスインタビュー調査など)及び二次資料による調査(Technavio独自のプラットフォーム、産業書籍、企業報告書、ニュース記事、アナリストレポート、貿易協会、政府機関発行データなど)

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