Global Semiconductor Capital Equipment Market 2015-2019

半導体製造装置の世界市場2015-2019

◆タイトル:Global Semiconductor Capital Equipment Market 2015-2019
◆商品コード:IRTNTR4677
◆調査・発行会社:Technavio (Infiniti Research Ltd.)
◆発行日:2014年11月26日
◆ページ数:82
◆資料形式:pdf / 英語
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【資料の概要】

当調査レポートでは、半導体製造装置の世界市場について調査・分析し、エグゼクティブサマリー、市場概観、業界の構造分析、半導体製造装置の世界市場規模及び予測、市場シェア、地域別分析、主要国別分析、購買基準、市場成長要因、市場の課題、市場動向、競争状況、主要企業(ベンダー)分析などの情報をお届けいたします。

About Semiconductor Capital Equipment
Semiconductor capital equipment are those used for manufacturing machines that are used in the production of semiconductors, which are also referred to as ICs and chips. Semiconductor manufacturing facilities are referred to as fabs. Semiconductor capital equipment can be divided into two types: front-end and back-end equipment. Some of the machines that use front-end equipment are etching, chemical polishing, and wafer fabrication. Some of the machines that use back-end equipment are those that are used for packaging and testing IC components.

TechNavio’s analysts forecast the Global Semiconductor Capital Equipment market to grow at a CAGR of 2.58 percent over the period 2014-2019.

[Covered in this Report]
This report covers the present scenario and the growth prospects of the Global Semiconductor Capital Equipment market for the period 2014-2019. To calculate the market size, the report considers revenue generated from the sales of semiconductor capital equipment worldwide. However, the report does not take into consideration the following while calculating the market size:
• Support or maintenance services that are offered for/with semiconductor capital equipment
• Components that are used in the production of semiconductor capital equipment
• Aftermarket sales of semiconductor capital equipment

TechNavio’s report, Global Semiconductor Capital Equipment Market 2015-2019, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the Americas, and the EMEA and APAC regions; it also covers the Global Semiconductor Capital Equipment market landscape and its growth prospects in the coming years. The report also includes a discussion of the key vendors operating in this market.

[Key Regions]
• Americas
• APAC
• EMEA

[Key Vendors]
• Applied Materials (AMAT)
• ASML Holdings
• Lam Research
• Tokyo Electron

[Other Prominent Vendors]
• Advantest
• ASM International
• Hitachi High-Technologies
• KLA-Tencor
• Nikon Instruments
• Screen Holdings
• Teradyne

[Market Driver]
• Rising Demand for Smartphones and Tablets
• For a full, detailed list, view our report

[Market Challenge]
• Rapid Changes in Technology
• For a full, detailed list, view our report

[Market Trend]
• Short Replacement Cycle of Portable Electronic Devices
• For a full, detailed list, view our report

[Key Questions Answered in this Report]
• What will the market size be in 2018 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?
• What are the market opportunities and threats faced by the key vendors?
• What are the strengths and weaknesses of the key vendors?

【資料の目次】

01. Executive Summary

02.List of Abbreviations

03.Scope of the Report
03.1 Market Overview
03.2 Product Offerings

04.Market Research Methodology
04.1 Market Research Process
04.2 Research Methodology

05.Introduction

06.Industry Overview
06.1 Semiconductor Industry Overview
06.1.1 Semiconductor Value Chain
06.2 Semiconductor Market Structure
06.3 Global Semiconductor Market Overview
06.3.1 Historical Regional Revenue Contribution for Semiconductor Market
06.4 Global Wafer Fab Equipment Market

07.Market Landscape
07.1 Market Size and Forecast
07.2 Five Forces Analysis

08.Geographical Segmentation
08.1 Global Semiconductor Capital Equipment Market by Geographical Segmentation 2014-2019
08.2 Global Semiconductor Capital Equipment Market by Geographical Segmentation 2014-2019
08.3 Semiconductor Capital Equipment Market in APAC Region
08.3.1 Market Size and Forecast
08.4 Semiconductor Capital Equipment Market in the Americas
08.4.1 Market Size and Forecast
08.5 Semiconductor Capital Equipment Market in EMEA
08.5.1 Market Size and Forecast

09.Key Leading Countries
09.1 Taiwan
09.2 South Korea
09.3 US

10.Buying Criteria

11.Market Growth Drivers

12.Drivers and their Impact

13.Market Challenges

14.Impact of Drivers and Challenges

15.Market Trends

16.Trends and their Impact

17.Vendor Landscape
17.1 Market Share Analysis 2014
17.2 Key Vendors
17.2.1 Applied Materials
17.2.2 ASML Holdings
17.2.3 Lam Research
17.2.4 Tokyo Electron
17.3 Other Prominent Vendors
17.3.1 KLA-Tencor
17.3.2 Screen Holdings
17.3.3 Advantest
17.3.4 Hitachi High-Technologies
17.3.5 Nikon Instruments
17.3.6 ASM International
17.3.7 Teradyne

18.Key Vendor Analysis
18.1 Applied Materials
18.1.1 Key Facts
18.1.2 Business Overview
18.1.3 Business Segmentation by Revenue 2013
18.1.4 Business Segmentation by Revenue 2012 and 2013
18.1.5 Geographical Segmentation by Revenue 2013
18.1.6 Business Strategy
18.1.7 Recent Developments
18.1.8 SWOT Analysis
18.2 ASML Holdings
18.2.1 Key Facts
18.2.2 Business Overview
18.2.3 Geographical Segmentation by Revenue 2013
18.2.4 Business Strategy
18.2.5 Recent Developments
18.2.6 SWOT Analysis
18.3 Lam Research
18.3.1 Key Facts
18.3.2 Business Overview
18.3.3 Product Segmentation
18.3.4 Geographical Segmentation by Revenue 2014
18.3.5 Business Strategy
18.3.6 Recent Developments
18.3.7 SWOT Analysis
18.4 Tokyo Electron
18.4.1 Key Facts
18.4.2 Business Overview
18.4.3 Business Segmentation by Revenue 2014
18.4.4 Business Segmentation by Revenue 2014
18.4.5 Geographical Segmentation by Revenue 2014
18.4.6 Business Strategy
18.4.7 Recent Developments
18.4.8 SWOT Analysis

19.Market Summary
19.1 Market Traction
19.1.1 Expansion Plans
19.1.2 New Equipment Purchases
19.2 Market Attractiveness

20.Other Reports in this Series

[List of Exhibits]
Exhibit 1: Market Research Methodology
Exhibit 2: Semiconductor Value Chain
Exhibit 3: Front-end Process
Exhibit 4: Back-end Process
Exhibit 5: Semiconductor Market Structure
Exhibit 6: Global Semiconductor Market 2014
Exhibit 7: Global Semiconductor Market Geographic Segmentation 2005-2012
Exhibit 8: Revenue Share of Various Processes in Semiconductor Production
Exhibit 9: Global Semiconductor Capital equipment Market 2014-2019 (US$ billion)
Exhibit 10: Global Semiconductor Capital Equipment Market by Geographical Segmentation 2014
Exhibit 11: Global Semiconductor Capital Equipment Market by Geographical Segmentation 2014-2019 (Percentage Share)
Exhibit 12: Global Semiconductor Capital Equipment Market Revenue by Geographical Segmentation 2014-2019 (US$ billion)
Exhibit 13: Comparison of Geographies by CAGR 2014-2019
Exhibit 14: Semiconductor Capital Equipment Market in Taiwan 2014-2019 (US$ billion)
Exhibit 15: Semiconductor Capital Equipment Market in South Korea 2014-2019 (US$ billion)
Exhibit 16: Semiconductor Capital Equipment Market in the US 2014-2019 (US$ billion)
Exhibit 17: CAGR Comparison between Key Leading Countries 2014-2019
Exhibit 18: Global Smartphone Market by Unit Shipments 2014-2019 (units in million)
Exhibit 19: Global Tablets Market by Unit Shipments 2014-2019 (units in million)
Exhibit 20: Global Semiconductor Capital Equipment Market by Vendor Segmentation 2014
Exhibit 21: Applied Materials: Business Segmentation by Revenue 2013
Exhibit 22: Applied Materials: Business Segmentation by Revenue 2012 and 2013 (US$ billion)
Exhibit 23: Applied Materials: Geographical Segmentation by Revenue 2013
Exhibit 24: ASML Holdings: Geographical Segmentation by Revenue 2013
Exhibit 25: Lam Research: Product Segmentation
Exhibit 26: Lam Research: Geographical Segmentation by Revenue 2014
Exhibit 27: Tokyo Electron: Business Segmentation by Revenue 2014
Exhibit 28: Tokyo Electron: Business Segmentation by Revenue 2014 (US$ million)
Exhibit 29: Tokyo Electron: Geographical Segmentation by Revenue 2014



【掲載企業】

Applied Materials (AMAT), ASML Holdings, Lam Research, Tokyo Electron, Advantest , ASM International , Hitachi High-Technologies, KLA-Tencor, Nikon Instruments, Screen Holdings, Teradyne

【資料のキーワード】

半導体製造装置、前工程、後工程、ICチップ、ウエハー、エッチング、パッケージング、検査

【調査方法】

一次資料による調査(業界専門家、ベンダー、代理店、顧客等を対象にしたデプスインタビュー調査など)及び二次資料による調査(Technavio独自のプラットフォーム、産業書籍、企業報告書、ニュース記事、アナリストレポート、貿易協会、政府機関発行データなど)

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